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Machine translation
1. (WO2001001487) INTEGRATED CIRCUIT DIE AND/OR PACKAGE HAVING A VARIABLE PITCH CONTACT ARRAY FOR MAXIMIZATION OF NUMBER OF SIGNAL LINES PER ROUTING LAYER
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/001487 International Application No.: PCT/US2000/014904
Publication Date: 04.01.2001 International Filing Date: 26.05.2000
Chapter 2 Demand Filed: 21.12.2000
IPC:
H01L 23/498 (2006.01) ,H05K 1/11 (2006.01)
Applicants: SIU, William, M.[CA/US]; US (UsOnly)
BHATTACHARYYA, Bidyut, K.[IN/US]; US (UsOnly)
INTEL CORPORATION[US/US]; 2200 Mission College Boulevard Santa Clara, CA 95052, US (AllExceptUS)
Inventors: SIU, William, M.; US
BHATTACHARYYA, Bidyut, K.; US
Agent: MALLIE, Michael., J. ; Blakely, Sokoloff, Taylor & Zafman LLP 7th Floor 12400 Wilshire Boulevard Los Angeles, CA 90025, US
Priority Data:
09/342,55029.06.1999US
Title (EN) INTEGRATED CIRCUIT DIE AND/OR PACKAGE HAVING A VARIABLE PITCH CONTACT ARRAY FOR MAXIMIZATION OF NUMBER OF SIGNAL LINES PER ROUTING LAYER
(FR) MATRICE ET/OU BOITIER DE CIRCUIT INTEGRE AVEC ENSEMBLE DE CONTACTS A ECARTEMENT VARIABLE, PERMETTANT DE MAXIMISER LE NOMBRE DE LIGNES DE SIGNAUX PAR COUCHE D'ACHEMINEMENT
Abstract: front page image
(EN) An integrated circuit die and/or package. An apparatus is described having a substrate with a central region and an outer region. A first plurality of electrical connections is spaced apart by a first distance on the outer region of the substrate. A second plurality of electrical connections is spaced apart by a second distance, smaller than the first distance, on the central region of the substrate.
(FR) Cette invention concerne une matrice et/ou un boîtier de circuit imprimé ainsi qu'un dispositif comportant une région centrale et une région extérieure. Une première pluralité de connexions électriques est implantée à une première distance sur la région extérieure du substrat. Une seconde pluralité de connexions électriques est implantée à une seconde distance, plus faible que la première distance, sur la région centrale du substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)