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1. (WO2001000508) SEMICONDUCTOR PACKAGE CLAD MATERIAL AND SEMICONDUCTOR PACKAGE USING THE SAME

Pub. No.:    WO/2001/000508    International Application No.:    PCT/JP2000/004156
Publication Date: Fri Jan 05 00:59:59 CET 2001 International Filing Date: Sat Jun 24 01:59:59 CEST 2000
IPC: H01L 23/31
H05K 3/06
H05K 3/44
Applicants: TOYO KOHAN CO., LTD.

SAIJO, Kinji

YOSHIDA, Kazuo

OKAMOTO, Hiroaki

OHSAWA, Sinji

Inventors: SAIJO, Kinji

YOSHIDA, Kazuo

OKAMOTO, Hiroaki

OHSAWA, Sinji

Title: SEMICONDUCTOR PACKAGE CLAD MATERIAL AND SEMICONDUCTOR PACKAGE USING THE SAME
Abstract:
A semiconductor package clad plate and a semiconductor package that can be produced at low cost and that have good characteristics. To this end, the clad material (33) is characterized by comprising Cu layer / Mo layer / Cu layer with a nickel layer (21) interposed to serve as an etching stopper layer (12). Further, the semiconductor package is produced such that a Cu layer (22) and a copper foil (24) are laminated on the clad material (33) and pressed to form a semiconductor package clad plate (34), which is selectively etched to form a window frame (17), to which a semiconductor chip (1) and a printed board (10) are attached.