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1. (WO2000065740) ENERGY CONDITIONING CIRCUIT ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2000/065740 International Application No.: PCT/US2000/011409
Publication Date: 02.11.2000 International Filing Date: 28.04.2000
Chapter 2 Demand Filed: 15.11.2000
IPC:
H01L 23/50 (2006.01) ,H01L 23/552 (2006.01) ,H03H 1/00 (2006.01) ,H05K 1/14 (2006.01) ,H05K 1/16 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50
for integrated circuit devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
552
Protection against radiation, e.g. light
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
1
Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
X2Y ATTENUATORS, L.L.C. [US/US]; 2700 West 21st Street Erie, PA 16506, US (AllExceptUS)
ANTHONY, Anthony, A. [US/US]; US (UsOnly)
Inventors:
ANTHONY, Anthony, A.; US
Agent:
NEIFELD, Richard, A.; Neifeld IP Law, P.C. 4813-B Eisenhower Avenue Alexandria, VA 22304, US
Priority Data:
60/131,38628.04.1999US
60/135,54224.05.1999US
60/136,45128.05.1999US
60/139,18215.06.1999US
60/146,98703.08.1999US
60/165,03512.11.1999US
60/180,10103.02.2000US
60/185,32028.02.2000US
Title (EN) ENERGY CONDITIONING CIRCUIT ASSEMBLY
(FR) ENSEMBLE CIRCUIT DE CONDITIONNEMENT D'ENERGIE
Abstract:
(EN) The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of components carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filter due to the increased shielding provided by the carriers. Embodiments of the carrier energy conditioning assembly include integrated circuit construction for a differential and common mode filter coupled to the power bus of an integrated circuit.
(FR) L'invention concerne un support (132) de composant constitué par une plaque de matériau isolant pourvue d'une pluralité d'ouvertures (140) servant à laisser passer les conducteurs d'un filtre différentiel et de mode commun (130). Dans un autre mode de réalisation, un support (10) de composant montable en surface est constitué par un disque (16) de matériau isolant comportant une pluralité d'ouvertures (24). Plusieurs autres modes de réalisation intègrent également le même concept de support se présentant soit de façon indépendante, soit encastré à l'intérieur de connecteurs électroniques. La configuration générale et les caractéristiques électriques de ces concepts s'appliquent également à un ensemble circuit de conditionnement d'énergie basé sur la combinaison de filtres différentiels et de mode commun avec des supports de composants optimisés pour ce type de filtres. Ces supports, dans leurs différents modes de réalisation, permettent d'obtenir une résistance physique améliorée, de protéger des filtres différentiels et de mode commun et, de ce fait, d'améliorer sensiblement les caractéristiques électriques de ces filtres, étant donné l'augmentation du blindage produite par ces supports. Des modes de réalisation de cet ensemble circuit de conditionnement d'énergie comprennent des architectures de circuits intégrés pour filtres différentiels et de mode commun couplés au bus de puissance d'un circuit intégré.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020020007391SG84279EP1177641JP2002543661 CN1373938AU2000048057