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Machine translation
1. (WO2000061832) METHOD AND GETTER DEVICES FOR USE IN DEPOSITION OF THIN LAYERS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/061832    International Application No.:    PCT/IT2000/000136
Publication Date: 19.10.2000 International Filing Date: 11.04.2000
Chapter 2 Demand Filed:    27.09.2000    
IPC:
C23C 14/56 (2006.01), F04B 37/04 (2006.01)
Applicants: SAES GETTERS S.P.A. [IT/IT]; Viale Italia, 77, I-20020 Lainate (IT) (For All Designated States Except US).
CONTE, Andrea [IT/IT]; (IT) (For US Only).
MAZZA, Francesco [IT/IT]; (IT) (For US Only).
MORAJA, Marco [IT/IT]; (IT) (For US Only)
Inventors: CONTE, Andrea; (IT).
MAZZA, Francesco; (IT).
MORAJA, Marco; (IT)
Agent: ADORNO, Silvano; Società Italiana Brevetti S.p.A., Via Carducci, 8, I-20123 Milano (IT)
Priority Data:
MI99A000744 12.04.1999 IT
Title (EN) METHOD AND GETTER DEVICES FOR USE IN DEPOSITION OF THIN LAYERS
(FR) PROCEDE ET DISPOSITIFS GETTER UTILISES POUR FORMER DES DEPOTS DE FINES COUCHES
Abstract: front page image
(EN)A method is described for increasing the yield in processes of deposition of thin layers on substrates by contacting activated getter devices with the atmosphere of process chambers when no substrates are processed and when the pressure of reactive gasses in the chambers is below about 10?-3¿ mbar, by adopting the procedures and the equipments already in the chambers for handling and heating the manufacturing substrates. The method is particularly useful when applied in sequences of operations (1; 2; 3; 4) comprised between opening of the process chambers and beginning of the manufacturing processes. Getter devices (50; 60; 70) are also described which are suitable to be used in the method.
(FR)L'invention concerne un procédé permettant d'augmenter le rendement de processus destinés à former des dépôts de fines couches sur des substrats, ce procédé consistant tout d'abord à mettre des dispositifs getter activés en contact avec l'atmosphère de chambres de traitement, et ce alors que celles-ci ne traitent aucun substrat et que la pression de gaz réactifs dans ces chambres est inférieure à 10?-3¿ mbar environ, puis à employer les procédures et équipements de manipulation et de chauffe des substrats fabriqués dans ces chambres. Le procédé de cette invention est particulièrement utile lorsqu'il s'applique à des opérations successives (1; 2; 3; 4), qui se déroulent entre l'ouverture desdites chambres de traitement et le début des processus de fabrication. Enfin, cette invention concerne des dispositifs getter (50; 60; 70) aptes à être utilisés selon ce procédé.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)