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1. (WO2000060911) METHOD FOR DRILLING CIRCUIT BOARDS

Pub. No.:    WO/2000/060911    International Application No.:    PCT/US2000/009001
Publication Date: Oct 12, 2000 International Filing Date: Apr 5, 2000
IPC: B23B 35/00
B23Q 11/10
H05K 3/00
Applicants: LAMINATING COMPANY OF AMERICA
MILLER, James, J.
DINNEWETH, Paul, E.
VANDERVELDE, Hans
HEGEDUIS, James, T.
Inventors: MILLER, James, J.
DINNEWETH, Paul, E.
VANDERVELDE, Hans
HEGEDUIS, James, T.
Title: METHOD FOR DRILLING CIRCUIT BOARDS
Abstract:
A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material (10) placed on the top surface of a stack (28) of printed circuit boards (30a-30d) and a lubricating backup board (34) placed beneath the bottom surface of the stack (28) of printed circuit boards (30a-30d). The lubricating entry material (10) has a core (20) with skins (12, 14) attached on both sides by a lubricant/adhesive (16, 18). Similarly, the backup board (34) has a core with skins (36, 38) attached on both sides by a lubricant/adhesive (40, 42). The skins (12, 14, 36, 38) are hard enough to support the top and bottom surfaces of the printed circuit boards (30a-30d) and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive (16, 18, 40, 42) coats the drilling tool (22) during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool (22).