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1. (WO2000060416) RADIATION-SENSITIVE RESIN COMPOSITION

Pub. No.:    WO/2000/060416    International Application No.:    PCT/JP2000/001259
Publication Date: Oct 12, 2000 International Filing Date: Mar 3, 2000
IPC: G03F 7/023
Applicants: CLARIANT INTERNATIONAL LTD.

ARANO, Akio

YAMAMOTO, Kenji

Inventors: ARANO, Akio

YAMAMOTO, Kenji

Title: RADIATION-SENSITIVE RESIN COMPOSITION
Abstract:
A radiation-sensitive resin composition which is excellent in various properties required of photoresists, such as sensitivity, pattern shape, and heat resistance, and has a well balanced combination of these properties. The composition comprises an alkali-soluble resin and a photosensitizer containing a quinonediazide group, wherein the alkali-soluble resin comprises a phenolic novolak from which the monomers and dimers have been selectively removed by a thin-film distillation treatment. The thin-film distillation treatment is preferably conducted so that the novolak before the treatment and that after the treatment, upon analysis by gel permeation chromatography with a 280-nm detector, give patterns satisfying the relationships B2/B1≥0.95 and C2/(A2+B2+C2)≤0.060, wherein A1, B1, and C1 respectively are the area of a high-molecular weight region, that of a medium-molecular weight region, and that of a monomer/dimer region in the pattern for the untreated novolak, while A2, B2, and C2 respectively are the area of a high-molecular weight region, that of a medium-molecular weight region, and that of a monomer/dimer region in the pattern for the treated novolak.