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Machine translation
1. (WO2000059680) POLISHING BODY, POLISHER, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/059680    International Application No.:    PCT/JP2000/001544
Publication Date: 12.10.2000 International Filing Date: 14.03.2000
Chapter 2 Demand Filed:    02.08.2000    
IPC:
B24B 37/20 (2012.01), B24B 37/26 (2012.01), B24D 13/14 (2006.01)
Applicants: NIKON CORPORATION [JP/JP]; 2-3, Marunouchi, 3-chome, Chiyoda-ku, Tokyo, Tokyo 100-1005 (JP) (For All Designated States Except US).
ISHIKAWA, Akira [JP/JP]; (JP) (For US Only).
SENGA, Tatsuya [JP/JP]; (JP) (For US Only).
MARUGUCHI, Shirou [JP/JP]; (JP) (For US Only).
ARAI, Takashi [JP/JP]; (JP) (For US Only).
NAKAHIRA, Hosei [JP/JP]; (JP) (For US Only).
MATSUKAWA, Eiji [JP/JP]; (JP) (For US Only).
MIYAJI, Akira [JP/JP]; (JP) (For US Only)
Inventors: ISHIKAWA, Akira; (JP).
SENGA, Tatsuya; (JP).
MARUGUCHI, Shirou; (JP).
ARAI, Takashi; (JP).
NAKAHIRA, Hosei; (JP).
MATSUKAWA, Eiji; (JP).
MIYAJI, Akira; (JP)
Agent: HOSOE, Toshiaki; 605 Corpo Fuji, 3-6, Nishikanagawa, 1-chome, Kanagawa-ku, Yokohama-shi, Kanagawa 221-0822 (JP)
Priority Data:
11/88157 30.03.1999 JP
11/98179 05.04.1999 JP
11/254941 08.09.1999 JP
2000/25373 02.02.2000 JP
2000/25386 02.02.2000 JP
Title (EN) POLISHING BODY, POLISHER, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
(FR) CORPS DE POLISSAGE, DISPOSITIF DE POLISSAGE, PROCEDE DE POLISSAGE ET PROCEDE DE FABRICATION D'UN DISPOSITIF A SEMI-CONDUCTEUR
Abstract: front page image
(EN)A hard polishing pad made of a nonfoaming material and used for a CMP machine. In the surface of the polishing pad, a spiral groove or concentric grooves and grid grooves are combinedly made. The angles at which the grooves intersect are two degrees or more. There are no edges having a radius of curvature of 50 $g(m)m or less on the surface. Consequently, no burrs are produced, and the object being polished is not scratched, thereby improving the polishing rate.
(FR)L'invention porte sur un tampon à polir dur fabriqué dans un matériau sans mousse et utilisé dans une machine CMP. Une gorge en spirale ou des gorges concentriques, ainsi que des gorges grillagées sont formées de manière combinée sur la surface du tampon. Les angles au niveau desquels les gorges s'entrecroisent sont au moins de deux degrés. Il n'y a pas de bords ayant un rayon de courbure égal ou inférieur à 50 $g(m)m sur la surface. Il n'y a donc pas de bavures, et l'objet en cours de polissage n'est pas rayé, ce qui accroît la vitesse de polissage.
Designated States: CN, KR, SG, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)