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Machine translation
1. (WO2000059276) A VIA CONNECTOR AND METHOD OF MAKING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/059276    International Application No.:    PCT/US1999/006729
Publication Date: 05.10.2000 International Filing Date: 29.03.1999
Chapter 2 Demand Filed:    19.09.2000    
IPC:
H05K 1/11 (2006.01), H05K 3/00 (2006.01), H05K 3/24 (2006.01), H05K 3/40 (2006.01), H05K 3/42 (2006.01)
Applicants: VIASYSTEMS, INC. [US/US]; 4500 South Laburnum Avenue Richmond, VA 23231 (US)
Inventors: PARKER, John, LeRoy, Jr.; (US).
MISCIKOWSKI, Pamela, L.; (US)
Agent: THOMAS, Michael, J.; Senniger, Powers, Leavitt & Roedel One Metropolitan Square 16th Floor St. Louis, MO 63102 (US)
Priority Data:
Title (EN) A VIA CONNECTOR AND METHOD OF MAKING SAME
(FR) CONNECTEUR DE TRAVERSEE ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN)An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The insulator substrate (12) and the sidewalls of the via are plated with conductive layer (14) and the via is filled with an electrically conductive fill composition (18). Conductive cap layers (20, 22) are formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
(FR)L"invention concerne un substrat isolant ou une carte à circuit imprimé (PCB) dotée d"une traversée pleine et plaquée. Le substrat (12) isolant et les parois latérales de la traversée sont plaqués avec une couche (14) conductrice et la traversée est remplie d"une composition (18) de remplissage conductrice. Des couches d"encapsulation (20, 22) conductrices sont formées aux deux extrémités de la composition de remplissage conductrice dans la traversée et les surfaces principales du substrat isolant et peuvent être collées à un contact de montage de surface tel qu"une pastille ou une plage de connexion.
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CU, CZ, DE, DK, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)