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Machine translation
1. (WO2000059000) METHOD FOR MAKING SEGMENTED THROUGH HOLES IN PRINTED CIRCUIT BOARDS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/059000    International Application No.:    PCT/US2000/008130
Publication Date: 05.10.2000 International Filing Date: 28.03.2000
Chapter 2 Demand Filed:    26.10.2000    
IPC:
H05K 1/09 (2006.01), H05K 3/06 (2006.01), H05K 3/10 (2006.01), H05K 3/18 (2006.01), H05K 3/40 (2006.01), H05K 3/42 (2006.01)
Applicants: BERG, N., Edward [US/US]; (US)
Inventors: BERG, N., Edward; (US)
Agent: SOLOWAY, Norman, P.; Hayes, Soloway, Hennessey, Grossman & Hage, P.C., 175 Canal Street, Manchester, NH 03101-2335 (US)
Priority Data:
60/126,678 29.03.1999 US
Title (EN) METHOD FOR MAKING SEGMENTED THROUGH HOLES IN PRINTED CIRCUIT BOARDS
(FR) REALISATION DE TROUS DE PASSAGE SEGMENTES DANS DES CARTES A CIRCUITS INTEGRES
Abstract: front page image
(EN)A method for forming segmented through holes in a printed circuit board (70). The segmented through holes comprise a plurality of electrically conductive pathways (102, 104) disposed on the walls of a single through hole. The segmented through hole can be disposed in a two sided circuit board assembly or in a composite, multi layer circuit board assembly.
(FR)La présente invention concerne un procédé permettant de réaliser des trous de passage segmentés dans une carte à circuits intégrés. Ces trous de passage segmentés comprennent une pluralité de voies de passage électro-conductrices disposées sur les parois d'un unique trou de passage. Un tel trou de passage segmenté peut être disposé dans un ensemble carte à circuits intégrés biface ou dans un ensemble carte à circuits intégrés composite multicouche.
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)