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Machine translation
1. (WO2000058051) LOW TEMPERATURE SOLDER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/058051    International Application No.:    PCT/US2000/008273
Publication Date: 05.10.2000 International Filing Date: 29.03.2000
Chapter 2 Demand Filed:    02.10.2000    
IPC:
B23K 35/26 (2006.01)
Applicants: ANTAYA TECHNOLOGIES CORPORATION [US/US]; 72 Fenner Street, Cranston, RI 02910 (US)
Inventors: PEREIRA, John; (US)
Agent: THIBODEAU, David, J., Jr.; Hamilton, Brook, Smith & Reynolds, P.C., Two Militia Drive, Lexington, MA 02421 (US)
Priority Data:
60/126,935 29.03.1999 US
09/346,423 01.07.1999 US
Title (EN) LOW TEMPERATURE SOLDER
(FR) BRASURE A BASSE TEMPERATURE
Abstract: front page image
(EN)The present invention includes a low temperature solder composition having a mixture of elements including indium, tin and silver. Less than about 75% of the composition by weight is tin.
(FR)L'invention concerne une composition de brasure à basse température contenant un mélange d'éléments, soit indium, étain et argent, l'étain constituant moins de 75 % en poids de la composition.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)