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1. WO2000054322 - FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL

Publication Number WO/2000/054322
Publication Date 14.09.2000
International Application No. PCT/US2000/005990
International Filing Date 08.03.2000
Chapter 2 Demand Filed 10.10.2000
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H01L 21/56 (2006.01)
H05K 3/34 (2006.01)
CPC
H01L 21/563
H01L 2224/16
H01L 2224/274
H01L 2224/73104
H01L 2224/73203
H01L 2224/81191
Applicants
  • ALPHA METALS, INC. [US/US]; 600 Route 440 Jersey City, NJ 07304, US
Inventors
  • GILLEO, Kenneth, Burton; US
  • BLUMEL, David; US
Agents
  • BERNSTEIN, David, B.; Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C. One Financial Center Boston, MA 02111, US
Priority Data
09/266,23210.03.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FLIP CHIP WITH INTEGRATED FLUX AND UNDERFILL
(FR) PUCES A PROTUBERANCES A FLUX ET MATIERE DE REMPLISSAGE INTEGRES
Abstract
(EN)
A flip chip having solder bumps and an integrated flux and underfill, as well as method for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simpliflying flip chip manufacturing processes which heretofore have required separatate fluxing and underfilling steps.
(FR)
L'invention concerne une puce à protubérances comprenant des perles de soudure, une matière de remplissage et un flux intégrés, ainsi que des procédés de fabrication d'un tel dispositif. Le dispositif ainsi obtenu convient parfaitement pour une application en une seule étape sur une carte de circuits imprimés, d'où une simplification des procédés de fabrication de la puce à protubérances par rapport aux procédés classiques qui nécessitent des étapes de flux et de remplissage séparées.
Also published as
Latest bibliographic data on file with the International Bureau