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1. WO2000044208 - FLEXIBLE MICROSYSTEM AND BUILDING TECHNIQUES

Publication Number WO/2000/044208
Publication Date 27.07.2000
International Application No. PCT/SE2000/000063
International Filing Date 14.01.2000
Chapter 2 Demand Filed 28.06.2000
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
CPC
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
H05K 3/326
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
325by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
326the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Applicants
  • PIEZOMOTORS UPPSALA AB [SE/SE]; Sylveniusgatan 5D S-754 50 Uppsala, SE (AllExceptUS)
  • JOHANSSON, Stefan [SE/SE]; SE (UsOnly)
  • KARLSSON, Staffan [SE/SE]; SE (UsOnly)
Inventors
  • JOHANSSON, Stefan; SE
  • KARLSSON, Staffan; SE
Agents
  • STENBORG, Anders ; Aros Patent AB P.O. Box 1544 S-751 45 Uppsala, SE
Priority Data
9900164-620.01.1999SE
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) FLEXIBLE MICROSYSTEM AND BUILDING TECHNIQUES
(FR) MICROSYSTEME SOUPLE ET TECHNIQUES DE FABRICATION
Abstract
(EN)
The present invention makes use of a flexible printed circuit board (10), not only as a mounting support for electronics components (24) and wiring (12), but also for mechanically supporting components (22) of an electromechanical transducer as well as acting as a main structural member for the entire microsystem. All components (22, 24, 26) necessary for a microsystem may be mechanically mounted onto a flexible printed circuit board (10), which finally is elastically deformed to a required final shape. In the final shape, the resilience of the flexible printed circuit board (10) is used to apply elastic forces on selected components (22) of the electromechanical transducer microsystem.
(FR)
La présente invention concerne une carte à circuit imprimé (10) souple, servant non seulement de support de montage pour des composants électroniques (24) et des câblages (12), mais aussi de support mécanique des composants (22) d'un transducteur électromécanique, ainsi que d'élément de structure principal pour l'ensemble du microsystème. Tous les composants (22, 24, 26) nécessaires à un microsystème peuvent être montés mécaniquement sur une carte à circuit imprimé (10) souple, qui est ensuite déformée élastiquement en une forme finale requise. Dans cette forme finale, l'élasticité de la carte à circuit imprimé (10) souple est utilisée pour appliquer des forces élastiques sur des composants (22) choisis du microsystème à transducteur électromécanique.
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