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1. WO2000043818 - EMI REDUCTION FOR OPTICAL SUBASSEMBLY

Considered void:  17.07.2001
Publication Number WO/2000/043818
Publication Date 27.07.2000
International Application No. PCT/US2000/000718
International Filing Date 12.01.2000
Chapter 2 Demand Filed 17.08.2000
IPC
G02B 6/42 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
CPC
G02B 6/4204
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4204the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B 6/4277
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4274Electrical aspects
4277Protection against electromagnetic interference [EMI], e.g. shielding means
G02B 6/4292
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4292the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Applicants
  • STRATOS LIGHTWAVE, INC. [US/US]; 7444 West Wilson Avenue Chicago, IL 60706, US
Inventors
  • GILLILAND, Patrick; US
Agents
  • BARRETT, Robert, M.; Bell, Boyd & Lloyd LLC P.O. Box 1135 Chicago, IL 60690-1135, US
Priority Data
09/235,57722.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) EMI REDUCTION FOR OPTICAL SUBASSEMBLY
(FR) ATTENUATION D'INTERFERENCES ELECTROMAGNETIQUES (EMI) DANS UN SOUS-ENSEMBLE OPTIQUE
Abstract
(EN)
An optoelectronic transmitter module (100) is provided for transmitting optical data signals from a host device. The module (100) is housed within a grounded chassis of the host device and provides a reduced effective aperture therethrough. The module (100) components include electronic circuitry (102) mounted within the module (100) configured to convert electrical data signals to an optical output signal. A conductive housing (112, 116) encloses the electronic circuitry (102). The module housing includes a first connector end adapted to receive a fiber optic (120) connector. When the module (100) is installed within the host device chassis, the connector end engages the host chassis to form a conductive barrier around the first end of the housing. A conductive transmitting optical subassembly (TOSA) is disposed within the connector end of the housing, forming a continuous conductive barrier therewith. The TOSA includes first and second ends with a narrow passage extending therebetween. The TOSA first end holds an optical package, and the second is configured to receive a fiber optic connector ferrule (120).
(FR)
La présente invention concerne un module émetteur optronique (100) servant à émettre les signaux numériques optiques d'un dispositif hôte. Le module (100), logé à l'intérieur d'un châssis mis à la terre du dispositif hôte, constitue une ouverture réduite appropriée. Les composants du module (100) incluent un circuit électronique (102) monté à l'intérieur du module (100) et configuré pour convertir les signaux numériques en signal de sortie optique. Un boîtier conducteur (112,116) renferme le circuit électronique (102). Le boîtier du module comprend une première extrémité de connecteur destinée à recevoir un connecteur de fibres optiques (120). Lorsque le module (100) est installé à l'intérieur du châssis du dispositif hôte, l'extrémité du connecteur touche le châssis de l'hôte de façon à former une barrière conductrice autour de la première extrémité du boîtier. Un sous-ensemble optique émetteur conducteur (TOSA) est placé dans l'extrémité du connecteur du boîtier, formant une barrière conductrice continue. Un étroit passage relie la première et la seconde extrémité dudit sous-ensemble (TOSA), la première extrémité servant de support à un bloc optique, et la seconde étant configurée pour recevoir une ferrule (120) de connecteur de fibres optiques.
Also published as
Latest bibliographic data on file with the International Bureau