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1. WO2000043574 - PROCESS FOR THE RECOVERY OF TIN, TIN ALLOYS OR LEAD ALLOYS FROM PRINTED CIRCUIT BOARDS

Publication Number WO/2000/043574
Publication Date 27.07.2000
International Application No. PCT/GB2000/000116
International Filing Date 18.01.2000
Chapter 2 Demand Filed 17.08.2000
IPC
C22B 25/06 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION OR REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
25Obtaining tin
06from scrap, especially tin scrap
C23F 1/44 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES; INHIBITING CORROSION OF METALLIC MATERIAL; INHIBITING INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25247
1Etching metallic material by chemical means
44Compositions for etching metallic material from a metallic material substrate of different composition
C23F 1/46 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES; INHIBITING CORROSION OF METALLIC MATERIAL; INHIBITING INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25247
1Etching metallic material by chemical means
46Regeneration of etching compositions
H05K 3/06 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
CPC
C22B 13/045
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION AND REFINING OF METALS
13Obtaining lead
04by wet processes
045Recovery from waste materials
C22B 25/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION AND REFINING OF METALS
25Obtaining tin
06from scrap, especially tin scrap
C23F 1/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
18for etching copper or alloys thereof
C23F 1/30
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
30for etching other metallic material
C23F 1/44
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
44Compositions for etching metallic material from a metallic material substrate of different composition
C23F 1/46
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
46Regeneration of etching compositions
Applicants
  • ALPHA FRY LIMITED [GB/GB]; St. Paul's House Warwick Lane London EC4P 4BN, GB (AllExceptUS)
  • EA TECHNOLOGY LIMITED [GB/GB]; Capenhurst Chester CH1 6ES, GB (AllExceptUS)
  • CAMBRIDGE UNIVERSITY TECHNICAL SERVICES LIMITED [GB/GB]; The Old Schools Trinity Lane Cambridgeshire CBT 1TS, GB (AllExceptUS)
  • GOODMAN, Paul, David [GB/GB]; GB (UsOnly)
  • HOLT, Lyn [GB/GB]; GB (UsOnly)
  • DALRYMPLE, Ian, McCrady [GB/GB]; GB (UsOnly)
  • FRAY, Derek, John [GB/GB]; GB (UsOnly)
  • GIBSON, Robert, William [GB/GB]; GB (UsOnly)
Inventors
  • GOODMAN, Paul, David; GB
  • HOLT, Lyn; GB
  • DALRYMPLE, Ian, McCrady; GB
  • FRAY, Derek, John; GB
  • GIBSON, Robert, William; GB
Agents
  • BOULT WADE TENNANT; Verulam Gardens 70 Gray's Inn Road London WC1X 8BT, GB
Priority Data
9901586.925.01.1999GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROCESS FOR THE RECOVERY OF TIN, TIN ALLOYS OR LEAD ALLOYS FROM PRINTED CIRCUIT BOARDS
(FR) RECUPERATION DE L'ETAIN ET DES ALLIAGES D'ETAIN OU DE PLOMB DES CARTES DE CIRCUITS IMPRIMES
Abstract
(EN)
A process for the selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards, comprises contacting the printed circuit board with a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), under conditions to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II) and recovering from the solution by electrolytic reduction substantially all of the Sn(II) and/or Pb(II) species as Sn and/or Pb. After the electrolytic reduction step the oxidant metal species is regenerated by oxidation and recycled to the first stage of the process.
(FR)
La présente invention concerne un procédé permettant une dissolution sélective de l'étain et/ou d'alliages à base d'étain ou de plomb des cartes de circuits imprimés. Ce procédé consiste à prendre la carte de circuit imprimé et à la mettre en contact avec une solution de Ti(IV) et d'un acide formant un sel stable et soluble de Ti(III), Ti(IV), Sn(II) et Pb(II), et ce, dans des conditions permettant la dissolution sensiblement de la totalité du Sn et/ou de l'alliage au Pb ou au Sn contenu dans la carte, sous forme de Sn(II) et/ou de Pb(II). On récupère ensuite dans la solution, par réduction électrolytique, la totalité des espèces Sn(II) et/ou Pb(II) sous forme de Sn et/ou de Pb. Après la réduction électrolytique, l'espèce métal oxydant subit une oxydation de régénération, ce qui ferme le circuit revenant à la première phase du processus.
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