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1. WO2000043159 - IMPROVED POLISHING PADS AND METHODS RELATING THERETO

Publication Number WO/2000/043159
Publication Date 27.07.2000
International Application No. PCT/US2000/001495
International Filing Date 21.01.2000
Chapter 2 Demand Filed 10.08.2000
IPC
B24B 37/04 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24D 11/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
11Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
B24D 11/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
11Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
04Zonally-graded surfaces
B24D 13/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
13Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
02acting by their periphery
12comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
B24D 13/14 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
13Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
14acting by the front face
B24D 3/34 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
34characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
CPC
B24B 37/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 37/24
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
20Lapping pads for working plane surfaces
24characterised by the composition or properties of the pad materials
B24D 13/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
13Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
02acting by their periphery
12comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
B24D 13/147
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
13Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
14acting by the front face
147comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
B24D 3/34
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
3Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
34characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Applicants
  • RODEL HOLDINGS, INC. [US/US]; Suite 1300 1105 North Market Street Wilmington, DE 19899, US
Inventors
  • JAMES, David, B.; US
  • COOK, Lee, Melbourne; US
  • BAKER, Arthur, Richard; US
Agents
  • BENSON, Kenneth, A.; Rodel Holdings, Inc. Suite 1300 1105 North Market Street Wilmington, DE 19899, US
Priority Data
60/116,54721.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) IMPROVED POLISHING PADS AND METHODS RELATING THERETO
(FR) TAMPONS A POLIR AMELIORES ET PROCEDES ASSOCIES
Abstract
(EN)
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and are sufficiently thin to generally improve predictability and polishing performance.
(FR)
L'invention concerne des tampons à polir améliorés, pouvant être utilisés pour la fabrication des dispositifs à semi-conducteurs ou similaires. Les tampons renferment un matériau de polissage hydrophile avantageux et sont suffisamment fins pour améliorer de manière générale la prévisibilité et les performances du polissage.
Latest bibliographic data on file with the International Bureau