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1. WO2000043156 - METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER

Publication Number WO/2000/043156
Publication Date 27.07.2000
International Application No. PCT/US2000/001576
International Filing Date 21.01.2000
Chapter 2 Demand Filed 16.08.2000
IPC
B23K 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
CPC
B23K 2101/36
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
B23K 3/0607
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
B23K 3/0692
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0646Solder baths
0692with intermediary means for bringing solder on workpiece, e.g. rollers
H05K 2203/0126
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
H05K 2203/0783
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
07Treatments involving liquids, e.g. plating, rinsing
0779characterised by the specific liquids involved
0783Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
H05K 2203/1105
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
11Treatments characterised by their effect, e.g. heating, cooling, roughening
1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Applicants
  • SPEEDLINE TECHNOLOGIES, INC. [US/US]; 16 Forge Park Franklin, MA 02038, US
Inventors
  • ROSSMEISL, Mark; US
  • FREEMAN, Gary; US
  • BALOG, Robert, J.; US
Agents
  • SULLIVAN, Thomas, M.; Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C. One Financial Center Boston, MA 02111, US
Priority Data
09/235,03421.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER
(FR) PROCEDE ET APPAREIL DE DISTRIBUTION DE SUBSTANCE DANS UNE IMPRIMANTE
Abstract
(EN)
A printer (10) for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer (10) includes a frame (12), a device, mounted to the frame (12), having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber (110) to contain the viscous material to be printed on the substrate. The chamber (110) has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame (12), positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.
(FR)
L'invention se rapporte à une imprimante (10) conçue pour déposer une substance visqueuse en des emplacements préétablis formant un motif sur un substrat. L'imprimante (10) comporte un châssis (12), un dispositif monté sur ledit châssis (12) et possédant un certain nombre de perforations disposées de manière à former ledit motif, un appareil de support qui est couplé au châssis et supporte le substrat en position d'impression sous le dispositif, et un distributeur de ladite substance. Ledit distributeur comporte une chambre (110) conçue pour contenir la matière visqueuse à déposer sur le substrat. Cette chambre (110) possède une ouverture à travers laquelle la substance est distribuée. Ledit distributeur est couplé au châssis (12), positionné au-dessus du dispositif et construit et disposé pour distribuer la substance visqueuse par les perforations ménagées dans le dispositif et la déposer sur le substrat. Le distributeur de substance comporte un organe de rétraction qui empêche les fuites de substance visqueuse par l'ouverture après achèvement de la distribution.
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