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1. WO2000042829 - ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLING WASTES OF THE SAME

Publication Number WO/2000/042829
Publication Date 20.07.2000
International Application No. PCT/JP2000/000058
International Filing Date 07.01.2000
Chapter 2 Demand Filed 22.05.2000
IPC
C22B 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION OR REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
13Obtaining lead
C22B 25/06 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION OR REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
25Obtaining tin
06from scrap, especially tin scrap
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
H05K 13/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
C22B 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION AND REFINING OF METALS
13Obtaining lead
C22B 25/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
BPRODUCTION AND REFINING OF METALS
25Obtaining tin
06from scrap, especially tin scrap
H01H 2009/0077
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
9Details of switching devices, not covered by groups H01H1/00 - H01H7/00
0077using recyclable materials, e.g. for easier recycling or minimising the packing material
H05K 1/0266
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0266Marks, test patterns, inspection means or identification means
H05K 1/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 13/0465
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
046Surface mounting
0465by soldering
Applicants
  • MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza-Kadoma Kadoma-shi Osaka-fu 571-8501, JP (AllExceptUS)
  • SUETSUGU, Kenichiro [JP/JP]; JP (UsOnly)
  • HIBINO, Shunji [JP/JP]; JP (UsOnly)
  • HIRANO, Masato [JP/JP]; JP (UsOnly)
  • YAMAGUCHI, Atsushi [JP/JP]; JP (UsOnly)
  • NAKATA, Mikiya [JP/JP]; JP (UsOnly)
Inventors
  • SUETSUGU, Kenichiro; JP
  • HIBINO, Shunji; JP
  • HIRANO, Masato; JP
  • YAMAGUCHI, Atsushi; JP
  • NAKATA, Mikiya; JP
Agents
  • ISHII, Kazuo; Kitahama-Yamamoto Building 3-6, Kitahama 2-chome Chuo-ku Osaka-shi Osaka 541-0041, JP
Priority Data
11/441111.01.1999JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLING WASTES OF THE SAME
(FR) ARTICLE MUNI D'UN CIRCUIT SOUDE AVEC DES PARTIES ET PROCEDE DE RECYCLAGE DE DECHETS DUDIT ARTICLE
Abstract
(EN)
The disclosure provides an article (6) having a circuit (1) mounted with parts (3) characterized by comprising an electronic part (3) soldered with a lead free solder (2) and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a cirucit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.
(FR)
L'invention concerne un article (6) comprenant un circuit (1) équipé de parties (3) caractérisé en ce qu'il comprend une partie électronique (3) soudée à l'aide d'une soudure sans plomb (2) ainsi qu'une marque d'identification indiquant qu'il est dépourvu de plomb. L'invention concerne également un appareil électrique comprenant ledit article. L'invention concerne en outre un procédé de recyclage de déchets dudit article. Cette invention permet d'obtenir un article comprenant un circuit équipé de parties ainsi qu'un appareil électrique comprenant ledit article qui permettent tous deux de détecter la présence de plomb nocif pour le corps humain.
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