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1. WO2000042657 - ELECTRONIC COMPONENT AND USE OF A PROTECTIVE STRUCTURE CONTAINED THEREIN

Publication Number WO/2000/042657
Publication Date 20.07.2000
International Application No. PCT/DE2000/000112
International Filing Date 13.01.2000
Chapter 2 Demand Filed 16.08.2000
IPC
H01L 23/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
60Protection against electrostatic charges or discharges, e.g. Faraday shields
CPC
G06K 9/00053
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
00006Acquiring or recognising fingerprints or palmprints
00013Image acquisition
00053Protecting the fingerprint sensor against damage caused by the finger
H01L 23/60
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
60Protection against electrostatic charges or discharges, e.g. Faraday shields
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Str. 53 D-81541 München, DE (AllExceptUS)
  • OPOLKA, Heinz [DE/DE]; DE (UsOnly)
  • VON BASSE, Paul-Werner [DE/DE]; DE (UsOnly)
  • SCHEITER, Thomas [DE/DE]; DE (UsOnly)
  • GROSSMANN, Rainer [DE/DE]; DE (UsOnly)
  • PETERS, Christian [DE/DE]; DE (UsOnly)
  • FISCHBACH, Reinhard [DE/DE]; DE (UsOnly)
  • GAYMANN, Andreas [DE/DE]; DE (UsOnly)
  • ROSTECK, Thomas [DE/DE]; DE (UsOnly)
  • SIPRAK, Domagoj [DE/DE]; DE (UsOnly)
  • SASSE, Thorsten [DE/DE]; DE (UsOnly)
  • GÖLLNER, Reinhard [DE/DE]; DE (UsOnly)
  • BIERNER, Justin [DE/DE]; DE (UsOnly)
  • MELZL, Michael [DE/DE]; DE (UsOnly)
  • HAMMER, Klaus [DE/DE]; DE (UsOnly)
  • WITTE, Markus [DE/DE]; DE (UsOnly)
Inventors
  • OPOLKA, Heinz; DE
  • VON BASSE, Paul-Werner; DE
  • SCHEITER, Thomas; DE
  • GROSSMANN, Rainer; DE
  • PETERS, Christian; DE
  • FISCHBACH, Reinhard; DE
  • GAYMANN, Andreas; DE
  • ROSTECK, Thomas; DE
  • SIPRAK, Domagoj; DE
  • SASSE, Thorsten; DE
  • GÖLLNER, Reinhard; DE
  • BIERNER, Justin; DE
  • MELZL, Michael; DE
  • HAMMER, Klaus; DE
  • WITTE, Markus; DE
Agents
  • INFINEON TECHNOLOGIES AG; Zedlitz, Peter Postfach 22 13 17 D-80503 München, DE
  • EPPING HERMANN & FISCHER GBR; Postfach 12 10 26 80034 München, DE
Common Representative
  • INFINEON TECHNOLOGIES AG; Zedlitz, Peter Postfach 22 13 17 D-80503 München, DE
Priority Data
199 01 384.515.01.1999DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) ELEKTRONISCHES BAUELEMENT UND VERWENDUNG EINER DARIN ENTHALTENEN SCHUTZSTRUKTUR
(EN) ELECTRONIC COMPONENT AND USE OF A PROTECTIVE STRUCTURE CONTAINED THEREIN
(FR) COMPOSANT ELECTRONIQUE ET UTILISATION D'UNE STRUCTURE DE PROTECTION A L'INTERIEUR DUDIT COMPOSANT
Abstract
(DE)
Es ist ein elektronisches Bauelement mit einer auf einem Substrat (10) ausgebildeten dielektrischen Schicht (2), leitenden Flächen (4; 14), die auf der dielektrischen Schicht ausgebildet sind, und einer elektrisch leitenden Schutzstruktur (6), die in einer Ebene oberhalb der leitenden Flächen (6) so angeordnet ist, daß die leitenden Flächen (4; 14) nicht von der Schutzstruktur (6) (vollständig) abgedeckt sind, vorgesehen.
(EN)
The invention relates to an electronic component, comprising a dielectric layer (2) which is configured on a substrate (10), conductive surfaces (4; 14) which are configured on said dielectric layer and an electroconductive protective structure (6) which is arranged in a plane above the conductive surfaces (6) in such a way that the conductive surfaces (4; 14) are not (entirely) covered by the protective structure (6).
(FR)
L'invention concerne un composant électronique, présentant une couche diélectrique (2) formée sur un substrat (10), des surfaces conductrices (4; 14) formée sur la couche diélectrique, ainsi qu'une structure de protection électroconductrice (6), disposée dans un plan situé au-dessus des surfaces conductrices (6), de façon que les surfaces conductrices (4; 14) ne soient pas (complètement) recouvertes par la structure de protection (6).
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