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1. WO2000042656 - POWER SEMICONDUCTOR MODULE WITH COVER

Publication Number WO/2000/042656
Publication Date 20.07.2000
International Application No. PCT/DE2000/000031
International Filing Date 04.01.2000
Chapter 2 Demand Filed 10.05.2000
IPC
H01L 23/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape
H01L 23/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
16Fillings or auxiliary members in containers, e.g. centering rings
18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
24solid or gel, at the normal operating temperature of the device
H01L 25/07 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
CPC
H01L 2224/45124
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
45124Aluminium (Al) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/48464
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
48464the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
H01L 2224/49175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
491Disposition
4912Layout
49175Parallel arrangements
Applicants
  • EUPEC EUROPÄISCHE GESELLSCHAFT FÜR LEISTUNGSHALBLEITER MBH & CO. KG [DE/DE]; Max-Planck-Strasse 5 D-59581 Warstein-Belecke, DE (AllExceptUS)
  • LODDENKÖTTER, Manfred [DE/DE]; DE (UsOnly)
  • FERBER, Gottfried [DE/DE]; DE (UsOnly)
  • LENNIGER, Andreas [DE/DE]; DE (UsOnly)
Inventors
  • LODDENKÖTTER, Manfred; DE
  • FERBER, Gottfried; DE
  • LENNIGER, Andreas; DE
Common Representative
  • Eupec Europäische Gesellschaft für Leistungshalbleiter mbH & CO. KG; c/o WESTPHAL, MUSSGNUG & PARTNER Mozartstrasse 8 80336 München, DE
Priority Data
299 00 370.112.01.1999DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) LEISTUNGSHALBLEITERMODUL MIT DECKEL
(EN) POWER SEMICONDUCTOR MODULE WITH COVER
(FR) MODULE A SEMI-CONDUCTEUR DE PUISSANCE AVEC COUVERCLE
Abstract
(DE)
Es wird ein Leistungshalbleitermodul (1) vorgeschlagen, bei dem die Anschlußelemente (4) in Öffnungen des Kunststoffgehäuses (2) eingebracht sind. Das Leistungshalbleitermodul weist ferner einen Deckel (12) auf, der dieses verschließt. Die Anschlußelemente ragen dabei über Öffnungen aus dem Deckel heraus. Die Öffnungen werden erst beim Zusammenfügen des Deckels und des Kunststoffgehäuses durch ein Durchstoßen mit den Anschlußelementen eingebracht. Hierdurch sind beliebige Anordnungen der Anschlußelemente im Leistungshalbleitermodul möglich. An den Stellen, an denen keine Anschlußelemente vorgesehen sind, verschließt der Deckel das Leistungshalbleitermodul.
(EN)
A power semiconductor module (1), whereby connector elements (4) are accommodated in the openings of a plastic housing (2). The power semiconductor module is also provided with a closing cover (12). The connector elements protrude above the cover and jut out of the openings. The openings are created when the cover and the plastic housing are assembled together and the connector elements protrude therethrough, whereby any arrangement of the connector elements in the power semiconductor module is possible. The cover closes the power semiconductor module at points where no connector elements are provided.
(FR)
Module (1) à semi-conducteur de puissance, dans lequel les éléments de raccordement (4) sont installés dans des ouvertures ménagées dans le boîtier (2) en plastique. Ledit module comporte en outre un couvercle (12) destiné à le fermer. Les éléments de raccordement font saillie au-dessus du couvercle par des ouvertures. Lesdites ouvertures résultent d'un perçage qui n'est opéré par les éléments de raccordement qu'au moment de l'assemblage du couvercle et du boîtier en plastique. Par conséquent, n'importe quelle disposition des éléments de raccordement est possible dans le module. En outre, le couvercle ferme le boîtier dans les endroits dans lesquels aucun élément de raccordement n'est prévu.
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