Processing

Please wait...

Settings

Settings

1. WO2000042650 - VACUUM TREATMENT DEVICE

Publication Number WO/2000/042650
Publication Date 20.07.2000
International Application No. PCT/JP2000/000077
International Filing Date 11.01.2000
Chapter 2 Demand Filed 28.06.2000
IPC
H01L 21/677 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
H01L 21/6835
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
H01L 21/68707
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68707the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Y10S 414/139
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
139including wafer charging or discharging means for vacuum chamber
Applicants
  • TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-chome Minato-ku, Tokyo 107-8481, JP (AllExceptUS)
  • OZAWA, Jun [JP/JP]; JP (UsOnly)
  • HIROSE, Jun [JP/JP]; JP (UsOnly)
  • HIROSE, Eiji [JP/JP]; JP (UsOnly)
  • KOIZUMI, Hiroshi [JP/JP]; JP (UsOnly)
Inventors
  • OZAWA, Jun; JP
  • HIROSE, Jun; JP
  • HIROSE, Eiji; JP
  • KOIZUMI, Hiroshi; JP
Agents
  • SATO, Kazuo ; Kyowa Patent & Law Office Room 323, Fuji Bldg. 2-3, Marunouchi 3-chome Chiyoda-ku, Tokyo 100-0005, JP
Priority Data
11/547412.01.1999JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) VACUUM TREATMENT DEVICE
(FR) DISPOSITIF DE TRAITEMENT SOUS VIDE
Abstract
(EN)
A vacuum treatment device, comprising a vacuum treatment chamber (1) etching a semiconductor wafer (W) as a body to be treated and a preliminary vacuum chamber (2) communicating with the vacuum treatment chamber (1), wherein a transfer arm (5) and first and second buffers (6, 7) for temporarily supporting the wafer (W) are installed in the preliminary vacuum chamber (2), the transfer arm (5) is provided with a flexible arm part (5a) and a support part (16) supporting the wafer (W), the arm part (5a) is extended and retracted by the rotations of a drive side swing arm (14) and a driven side swing arm (15) forming the arm (5a) so as to move the support part (16) straight forward and backward while maintaining it in its attitude, and the first and second buffers (6, 7) are disposed on the motion route of the support part (16) of the transfer arm (5).
(FR)
L'invention concerne un dispositif de traitement sous vide, qui comprend une chambre de traitement sous vide (1) pour l'attaque d'une plaquette en semiconducteur (W) constituant le corps à traiter, et une chambre à vide préliminaire (2) communiquant avec la chambre de traitement sous vide (1). Un bras de transfert (5) et des premier et second organes tampons (6, 7) pour le soutien temporaire de la plaquette (W) sont installés dans la chambre à vide préliminaire (2), le bras de transfert (5) étant muni d'une partie flexible (5a) et d'une partie support (16) soutenant la plaquette (W). La partie flexible (5a) est étendue et rétractée par les rotations d'un bras oscillant latéral d'entraînement (14) et d'un bras oscillant latéral entraîné (15), constitutives de cette partie flexible (5a), pour déplacer la partie support (16) de manière rectiligne vers l'avant et l'arrière tout en maintenant son orientation. Les premier et second organes tampons (6, 7) sont placés sur le trajet de déplacement de la partie support (16) du bras de transfert (5).
Latest bibliographic data on file with the International Bureau