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1. WO2000042637 - METHOD AND DEVICE FOR TREATING TABULAR SUBSTRATES, ESPECIALLY SILICON WAFERS FOR PRODUCING MICROELECTRONIC ELEMENTS

Publication Number WO/2000/042637
Publication Date 20.07.2000
International Application No. PCT/EP1999/000252
International Filing Date 18.01.1999
Chapter 2 Demand Filed 17.11.1999
IPC
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
Applicants
  • KUNZE-CONCEWITZ, Horst [DE/DE]; DE
Inventors
  • KUNZE-CONCEWITZ, Horst; DE
Agents
  • STEIMLE, Joseph; Dreiss, Fuhlendorf, Steimle & Becker Postfach 10 37 62 D-70032 Stuttgart, DE
Priority Data
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUM BEHANDELN VON FLÄCHIGEN SUBSTRATEN, INSBESONDERE SILIZIUM-SCHEIBEN (WAFER) ZUR HERSTELLUNG MIKROELEKTRONISCHER BAUELEMENTE
(EN) METHOD AND DEVICE FOR TREATING TABULAR SUBSTRATES, ESPECIALLY SILICON WAFERS FOR PRODUCING MICROELECTRONIC ELEMENTS
(FR) PROCEDE ET DISPOSITIF DE TRAITEMENT DE SUBSTRATS PLATS, EN PARTICULIER DE TRANCHES DE SILICIUM POUR LA FABRICATION DE COMPOSANTS MICROELECTRONIQUES
Abstract
(DE)
Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Behandeln von flächigen Substraten (5), wobei das Substrat (5) in einen engen Spalt (62) zwischen zwei Schildern (60, 61) angeordnet ist.
(EN)
The invention relates to a method and to a device for treating tabular substrates (5) according to which said substrate (5) is arranged in a narrow gap (62) between two plates (60, 61).
(FR)
Procédé et dispositif de traitement de substrats plats (5), le substrat (5) étant placé dans un interstice étroit (62) ménagé entre deux plaques (60, 61).
Also published as
US09889376
Latest bibliographic data on file with the International Bureau