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1. WO2000042629 - AN OPTOELECTRONIC ASSEMBLY

Publication Number WO/2000/042629
Publication Date 20.07.2000
International Application No. PCT/US2000/000416
International Filing Date 06.01.2000
Chapter 2 Demand Filed 31.07.2000
IPC
G02B 6/42 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
H01L 31/0203 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0203Containers; Encapsulations
H01L 31/0232 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0232Optical elements or arrangements associated with the device
CPC
G02B 6/4204
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4204the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B 6/4226
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
4226Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
G02B 6/4237
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
4236Fixing or mounting methods of the aligned elements
4237Welding
G02B 6/4238
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
4236Fixing or mounting methods of the aligned elements
4238Soldering
G02B 6/4248
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4248Feed-through connections for the hermetical passage of fibres through a package wall
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Applicants
  • LIGHTLOGIC, INC. [US/US]; Building 1 3350 Scott Boulevard Santa Clara, CA 95054, US
Inventors
  • VERDIELL, Jean-Marc; US
Agents
  • MALLIE, Michael, J. ; Blakely, Sokoloff, Taylor & Zafman LLP 7th floor 12400 Wilshire Boulevard Los Angeles, CA 90025, US
Priority Data
09/229,39511.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) AN OPTOELECTRONIC ASSEMBLY
(FR) ENSEMBLE OPTO-ELECTRONIQUE
Abstract
(EN)
A package (10) for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate (12) having a positioning floor (14), a platform (20) and an optional ring frame (32) of precisely determined height. Optical components picked and placed on a substrate floor, a raised platform and frame. A flexure assembly (24) allows fine positioning of components requiring critical optical alignment.
(FR)
Cette invention concerne un ensemble de conditionnement (10) pour composants optiques et une méthode de réalisation de ce conditionnement. Cet ensemble comprend un substrat (12) quasi plat comportant une surface inférieure de positionnement (14), une plate-forme (20) et, éventuellement, un cadre annulaire (32) d'une hauteur déterminée avec précision. Les composants optiques sont montés sur le substrat, la plate-forme surélevée et dans le cadre. Un ensemble flexible (24) permet de positionner avec précision les composants dont l'alignement optique est essentiel.
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