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1. WO2000042461 - METHOD FOR MAKING INTEGRATED OPTICAL DEVICES CONNECTED TO OPTICAL FIBERS AND DEVICES PRODUCED BY THE METHOD

Publication Number WO/2000/042461
Publication Date 20.07.2000
International Application No. PCT/CA1999/000858
International Filing Date 21.09.1999
Chapter 2 Demand Filed 04.08.2000
IPC
G02B 6/30 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
26Optical coupling means
30for use between fibre and thin-film device
CPC
G02B 6/30
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
26Optical coupling means
30for use between fibre and thin-film device
Applicants
  • NU-WAVE PHOTONICS INC. [CA/CA]; 2305 St. Laurent Blvd. Ottawa, Ontario K1G 4J8, CA
Inventors
  • HATAMI-HANZA, Hamid; CA
  • BENHAM, Victor; CA
Agents
  • SADIK, Achmed, N.; Station B P.O. Box 908 Ottawa, Ontario K1P 5P9, CA
Priority Data
2,258,10311.01.1999CA
2,274,19310.06.1999CA
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR MAKING INTEGRATED OPTICAL DEVICES CONNECTED TO OPTICAL FIBERS AND DEVICES PRODUCED BY THE METHOD
(FR) PROCEDE DE FABRICATION DE DISPOSITIFS OPTIQUES INTEGRES CONNECTES A DES FIBRES OPTIQUES ET DISPOSITIFS AINSI OBTENUS
Abstract
(EN)
An integrated optical board (IOB) is made by embedding and securing optical fibers (13) in a substrate (10), and then excising the ends of the substrate to serve as optical connectors (15, 16). The remaining part of the substrate may be processed, for example by carving out part (17) or parts (18, 19) of its top layer, to create optical components, such as planar waveguides (23), therein using the alignment markers (12) for accurate positioning of the waveguide with respect to embedded fiber cores.
(FR)
L'invention concerne une carte optique intégrée obtenue par l'incrustation et la fixation de fibres optiques (13) dans un substrat (10), puis par l'ablation des extrémités du substrat, pour servir de connecteurs optiques (15, 16). Le reste du substrat peut être traité, par example par un découpage d'une partie (17) ou de plusieurs parties (18, 19) de sa couche supérieure, de façon à former des composants optiques, tels que des guides d'ondes planaires (23), au moyen de marqueurs d'alignement (12) pour un positionnement précis du guide d'ondes par rapport aux coeurs de fibres incrustées.
Also published as
Latest bibliographic data on file with the International Bureau