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1. WO2000042405 - RIGID ENCAPSULATION PACKAGE FOR SEMICONDUCTOR PRESSURE SENSORS

Publication Number WO/2000/042405
Publication Date 20.07.2000
International Application No. PCT/US1999/025530
International Filing Date 29.10.1999
Chapter 2 Demand Filed 01.06.2000
IPC
G01L 9/00 2006.01
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
CPC
G01L 19/0038
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
0007Fluidic connecting means
0038being part of the housing
G01L 19/0084
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
0061Electrical connection means
0084to the outside of the housing
G01L 19/147
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
147Details about the mounting of the sensor to support or covering means
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
Applicants
  • MAXIM INTEGRATED PRODUCTS, INC. [US/US]; 120 San Gabriel Drive Sunnyvale, CA 94068, US
Inventors
  • NASIRI, Steven, S.; US
  • BURNS, David, W.; US
  • BRYZEK, Janusz; US
Agents
  • BLAKELY, Roger, W. ; Blakely, Sokoloff, Taylor & Zafman 7th floor 12400 Wilshire Boulevard Los Angeles, CA 90025-1026, US
Priority Data
09/232,80115.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) RIGID ENCAPSULATION PACKAGE FOR SEMICONDUCTOR PRESSURE SENSORS
(FR) ENSEMBLE RIGIDE D'ENCAPSULATION POUR CAPTEUR DE PRESSION A SEMI-CONDUCTEUR
Abstract
(EN)
A rigid encapsulation package for semiconductor sensors, actuators, and devices is described. In one embodiment, a semiconductor pressure sensor includes a sensor element having a deformable diaphragm for measurement of pressure, and a cap that includes a recess. The cap is attached to the sensor element to form a cavity therebetween. The pressure sensor further includes a leadframe, interconnecting bond wires, a pressure port that is coupled to the sensor element, and a nominally rigid material formed over the sensor element, cap, leadframe, and bond wires. The material may include one or more of the following: epoxy, RTV, resins, and gel. The sensor element may include a built-in stress isolation flexible region. A second pressure port may optionally be attached to the housing for providing differential or gage pressure measurements.
(FR)
Cette invention concerne un ensemble rigide d'encapsulation pour capteurs à semi-conducteur, des actionneurs, et des dispositifs correspondants. Dans un mode de réalisation, un capteur de pression à semi-conducteur comprend un élément de capteur doté d'une membrane déformable destinée à mesurer la pression, et d'un élément de protection dans lequel est ménagée une encoche. L'élément de protection est fixé à l'élément de capteur de manière à former une cavité entre les deux éléments mentionnés. Le capteur de pression comprend également un cadre de montage pour la connexion des fils de connexion, une prise de pression couplée à l'élément de capteur, et un matériau quasiment rigide recouvrant l'élément de capteur, l'élément de protection, le cadre de montage, et les fils de connexion. Ledit matériau peut comprendre l'un ou plusieurs des composés suivants: époxyde, composés à vulcanisation à la température ambiante (RTV), résines et gel. L'élément de capteur peut comprendre une zone souple d'isolation à la contrainte intégrée. Une seconde prise de pression peut éventuellement être fixée au boîtier afin d'effectuer des mesures de pression différentielle ou de pression relative.
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