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1. WO2000042115 - PHOTO CURABLE ADHESIVE COMPOSITION

Publication Number WO/2000/042115
Publication Date 20.07.2000
International Application No. PCT/NL2000/000014
International Filing Date 11.01.2000
Chapter 2 Demand Filed 18.07.2000
IPC
C08G 59/68 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68characterised by the catalysts used
CPC
C08G 59/68
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
68characterised by the catalysts used
Applicants
  • DSM N.V. [NL/NL]; Het Overloon 1 NL-6411 TE Heerlen, NL (AllExceptUS)
  • JSR CORPORATION [JP/JP]; JSR Building 2-11-24, Tsukiji Chuo-ku Tokyo 104-8410, JP (AllExceptUS)
  • JAPAN FINE COATINGS CO., LTD. [NL/NL]; 2-11-24, Tsukiji Chuo-ku Tokyo 104-8410, JP (AllExceptUS)
  • NOMIYAMA, Hitomi [JP/JP]; JP (UsOnly)
  • TAKEHANA, Yuichi [JP/JP]; JP (UsOnly)
  • TANABE, Takayoshi [JP/JP]; JP (UsOnly)
  • UKACHI, Takashi [JP/JP]; JP (UsOnly)
Inventors
  • NOMIYAMA, Hitomi; JP
  • TAKEHANA, Yuichi; JP
  • TANABE, Takayoshi; JP
  • UKACHI, Takashi; JP
Agents
  • DEN HARTOG, Jeroen, Hendrikus, Joseph; DSM Patents & Trademarks P.O. Box 9 NL-6160 MA Geleen, NL
Priority Data
H11-601213.01.1999JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PHOTO CURABLE ADHESIVE COMPOSITION
(FR) COMPOSITION ADHESIVE DURCISSANT A LA LUMIERE
Abstract
(EN)
To provide a photo curable resin composition comprising (A) a cationically polymerizable organic compound, (B) a cationic photopolymerization initiator, (C) a polyol having two or more hydroxyl groups in the molecule, and (D) an organotin compound. Since the photo curable resin composition of the present invention has excellent moisture-heat resistance, the resin composition is very useful as an adhesive used in the manufacture of optical disks compared to conventional adhesives.
(FR)
L'invention concerne un procédé d'obtention d'une composition de résine durcissant à la lumière et comprenant : (A) un composé organique se polymérisant de manière cationique, (B) un initiateur de photopolymérisation cationique, (C) un polyol contenant au moins deux groupes hydroxyles dans sa molécule, et (D) un composé organotine. Etant donné que cette composition de résine durcissant à la lumière possède une excellente résistance à la chaleur et à l'humidité, elle est très utile en tant qu'adhésif dans la fabrication de disques optiques, par comparaison à des adhésifs classiques.
Also published as
Latest bibliographic data on file with the International Bureau