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1. WO2000042098 - THERMALLY CONDUCTIVE THERMOPLASTIC

Publication Number WO/2000/042098
Publication Date 20.07.2000
International Application No. PCT/US2000/000639
International Filing Date 11.01.2000
Chapter 2 Demand Filed 31.07.2000
IPC
C08K 3/38 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
CPC
C08K 2003/385
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
382and nitrogen
385Binary compounds of nitrogen with boron
C08K 3/38
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
38Boron-containing compounds
Applicants
  • FERRO CORPORATION [US/US]; 1000 Lakeside Avenue Cleveland, OH 44114, US
Inventors
  • ZHUO, Qizhuo; US
  • HARRIS, Ronald, M.; US
  • SKOVRAN, Dennis, C.; US
  • LIGHTNER, Leo, F.; US
  • RANDALL, Michael, S.; US
  • STYGAR, Vernon, E.; US
Agents
  • CLARK, Kenneth, A.; Rankin, Hill, Porter & Clark LLP Suite 700 925 Euclid Avenue Cleveland, OH 44115-1405, US
Priority Data
09/228,26511.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) THERMALLY CONDUCTIVE THERMOPLASTIC
(FR) THERMOPLASTIQUE THERMOCONDUCTEUR
Abstract
(EN)
This invention relates to a thermally conductive moldable polymer blend comprising a thermoplastic polymer having a tensile at yield of at least 10,000 psi; at least 60 % by weight of a mixture of boron nitride powders having an average particle size of at least 50 microns; and a coupling agent. The composition displays a thermal conductivity of at least about 15 W/m°K and it is capable of being molded using high speed molding techniques such as injection molding.
(FR)
La présente invention concerne un mélange de polymérique moulable thermoconducteur comprenant un polymère thermoplastique polymère présentant un traction au seuil haut d'écoulement de 10000 psi, au moins 60 % en poids d'un mélange de poudres de nitrure de bore dont les particules possèdent une granulométrie moyenne d'au moins 50 microns, et un agent de couplage. Cette composition présente une conductivité thermique d'au moins environ 15 W/m °K, et elle peut être moulée à l'aide de techniques de moulage à grande vitesse, telles que le moulage par injection.
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