Processing

Please wait...

Settings

Settings

1. WO2000041884 - COMPOSITE FILM

Publication Number WO/2000/041884
Publication Date 20.07.2000
International Application No. PCT/JP1999/000409
International Filing Date 01.02.1999
Chapter 2 Demand Filed 09.08.2000
IPC
C08G 73/10 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08J 7/04 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7Chemical treatment or coating of shaped articles made of macromolecular substances
04Coating
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
CPC
C08G 73/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
73Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C08J 2479/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
2479Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
C08J 7/0427
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
7Chemical treatment or coating of shaped articles made of macromolecular substances
04Coating
0427with only one layer of a composition containing a polymer binder
H05K 1/0346
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0313Organic insulating material
032consisting of one material
0346containing N
H05K 2201/0154
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0154Polyimide
H05K 3/022
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Applicants
  • PI R & D CO., LTD. [JP/JP]; 12-5, Torihamacho Kanazawa-ku Yokohama-shi Kanagawa 236-0002, JP (AllExceptUS)
  • ITATANI, Hiroshi [JP/JP]; JP (UsOnly)
  • MATSUMOTO, Shunichi [JP/JP]; JP (UsOnly)
Inventors
  • ITATANI, Hiroshi; JP
  • MATSUMOTO, Shunichi; JP
Agents
  • TANIGAWA, Hidejiro; Tanigawa and Associates Iwata Building, 6F 5-12, Iidabashi 4-chome Chiyoda-ku Tokyo 102-0072, JP
Priority Data
11/4364813.01.1999JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COMPOSITE FILM
(FR) FILM COMPLEXE
Abstract
(EN)
A composite film having excellent heat resistance. The film is obtained by applying a solution of a solvent-soluble polyimide having a backbone formed by the polycondensation of one or more tetracarboxylic dianhydrides with one or more diamines to at least one surface of a base film and drying the solution to form a polyimide film on the surface. The backbone of the solvent-soluble polyimide comprises units of bicyclo(2,2,2)oct-7-ene-2,3,5,6-tetracarboxylic dianhydride as at least part of the tetracarboxylic dianhydrides and/or units of at least either of 3,5-diaminobenzoic acid and a diaminosiloxane derivative as at least part of the diamines.
(FR)
L'invention concerne un film complexé présentant une excellente tenue à la chaleur. On fabrique ledit film en appliquant une solution d'un polyimide soluble dans un solvant, possédant un squelette formé par polycondensation d'un ou plusieurs dianhydrides tétracarboxyliques avec une ou plusieurs diamines sur au moins une surface d'une film de base, et en laissant sécher la solution pour former un film de polyimide sur la surface. Le squelette du polyimide soluble dans du solvant, comporte des motifs de dianhydride bicyclo(2,2,2)oct-7-ène-2,3,5,6-tétracarboxylique en tant qu'au moins une partie des dianhydrides tétracarboxyliques et/ou des motifs d'au moins un acide 3,5-diaminobenzoïque et d'un dérivé de diaminosiloxane en tant qu'au moins une partie des diamines.
Also published as
Latest bibliographic data on file with the International Bureau