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1. WO2000041875 - EXTREME-UV LITHOGRAPHY VACUUM CHAMBER ZONE SEAL

Publication Number WO/2000/041875
Publication Date 20.07.2000
International Application No. PCT/US2000/000827
International Filing Date 12.01.2000
Chapter 2 Demand Filed 11.08.2000
IPC
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
CPC
G03F 7/70808
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
G03F 7/70833
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
G03F 7/70841
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
70841Constructional issues related to vacuum environment
Applicants
  • EUV LIMITED LIABILITY CORPORATION [US/US]; MS SC1-02 2200 Mission College Boulevard Santa Clara, CA 95052, US (AE, AL, AM, AT, AU, AZ, BA, BB, BE, BF, BG, BJ, BR, BY, CA, CF, CG, CH, CI, CM, CN, CR, CU, CY, CZ, DE, DK, DM, EE, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GR, GW, HR, HU, ID, IE, IL, IN, IS, IT, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MC, MD, MG, MK, ML, MN, MR, MW, MX, NE, NL, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, SN, SZ, TD, TG, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW)
  • HANEY, Steven, J. [US/US]; US (UsOnly)
  • HERRON, Donald, Joe [US/US]; US (UsOnly)
  • KLEBANOFF, Leonard, E. [US/US]; US (UsOnly)
  • REPLOGLE, William, C. [US/US]; US (UsOnly)
Inventors
  • HANEY, Steven, J.; US
  • HERRON, Donald, Joe; US
  • KLEBANOFF, Leonard, E.; US
  • REPLOGLE, William, C.; US
Agents
  • JEW, Charles, H.; Burns, Doane, Swecker & Mathis, LLP P.O. Box 1404 Alexandria, VA 22313-1404, US
Priority Data
09/229,82613.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) EXTREME-UV LITHOGRAPHY VACUUM CHAMBER ZONE SEAL
(FR) JOINT DE ZONE DE CHAMBRE A VIDE EN LITHOGRAPHIE A U.V. EXTREMES
Abstract
(EN)
Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices (73, 74, 75, 77, 78) for adjoining the perimeter of each tray (40, 60) to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.
(FR)
L'invention consiste à surveiller la contamination particulaire sur le réticule et la contamination carbonique de surfaces optiques dans des systèmes photolithographiques en établissant plusieurs zones de pression dans lesdits systèmes. Les différentes zones comprennent le réticule, un dispositif d'optique, une plaquette, et d'autres composants dudit système. Ce système comporte un appareil à vide incluant un boîtier qui est une chambre à vide, au moins un plateau de métrologie situé à l'intérieur de la chambre à vide, chacun de ces plateaux étant soutenu par au moins un élément de support. Ledit plateau sépare la chambre à vide en divers compartiments qui sont maintenus à différentes pressions. L'appareil à vide comprend également des dispositifs de scellement limitant la conductance (73, 74, 75, 77, 78) servant à assembler le périmètre de chaque plateau (40, 60) à la surface interne du boîtier, à l'intérieur duquel le plateau est dissocié des vibrations provenant de la surface interne du boîtier.
Also published as
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