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1. WO2000041839 - LASER BEAM MACHINING AND LASER BEAM MACHINE

Publication Number WO/2000/041839
Publication Date 20.07.2000
International Application No. PCT/JP2000/000124
International Filing Date 13.01.2000
IPC
B23K 26/067 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
067Dividing the beam into multiple beams, e.g. multi-focusing
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
B23K 26/0622
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/0626
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0626Energy control of the laser beam
B23K 26/067
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
067Dividing the beam into multiple beams, e.g. multifocusing
B23K 26/0673
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
067Dividing the beam into multiple beams, e.g. multifocusing
0673into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
H05K 3/0026
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0017Etching of the substrate by chemical or physical means
0026by laser ablation
Applicants
  • HITACHI VIA MECHANICS, LTD. [JP/JP]; 2100, Kamiimaizumi Ebina-shi, Kanagawa 243-0488, JP (AllExceptUS)
  • ARAI, Kunio [JP/JP]; JP (UsOnly)
  • WATANABE, Humio [JP/JP]; JP (UsOnly)
Inventors
  • ARAI, Kunio; JP
  • WATANABE, Humio; JP
Agents
  • TAKE, Kenjiro; Kashiwaya Building 6-13, Nishishinbashi 1-chome Minato-ku Tokyo 105-0003, JP
Priority Data
11/825214.01.1999JP
2000/369812.01.2000JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER BEAM MACHINING AND LASER BEAM MACHINE
(FR) PROCEDE ET DISPOSITIF D'USINAGE LASER
Abstract
(EN)
As many beam distributing/shaping devices (21a, 21b) as the number of heads (7a, 7b) are disposed in series on an optical path of a laser beam (2) emitted from a laser oscillator (1). Then, the devices (21a, 21b) are operated to supply a laser pulse to one of positioning-completed heads. A laser beam (2) with a generally constant energy quantity can be supplied to a machining unit by selecting a timing at which the devices (21a, 21b) are operated, whereby it is possible to machine a high-quality hole by effectively using a laser oscillator and accurately controlling a machining energy.
(FR)
Le procédé de l'invention consiste à prendre le même nombre de dispositifs de distribution ou de mise en forme (21a, 21b) que de têtes (7a, 7b) et à les monter en série sur le trajet optique d'un faisceau laser (2) émis par un oscillateur laser (1). On met en oeuvre alors les dispositifs (21a, 21b) de façon qu'ils appliquent une impulsion laser à l'une des têtes d'achèvement du positionnement. Un faisceau laser (2) à puissance stabilisée peut alors être envoyé sur une unité d'usinage. Il suffit dans ce cas de préciser les limites temporelles de la mise en oeuvre des dispositifs (21a, 21b). L'utilisation d'un oscillateur laser et la gestion de précision de l'énergie d'usinage font que le procédé de l'invention permet un alésage de haute qualité.
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