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1. WO2000041459 - SEMICONDUCTOR ELEMENT WITH A TUNGSTEN OXIDE LAYER AND METHOD FOR ITS PRODUCTION

Publication Number WO/2000/041459
Publication Date 20.07.2000
International Application No. PCT/DE2000/000047
International Filing Date 05.01.2000
Chapter 2 Demand Filed 04.08.2000
IPC
H01L 21/28 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
H01L 21/316 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
314Inorganic layers
316composed of oxides or glassy oxides or oxide-based glass
H01L 29/51 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
40Electrodes
43characterised by the materials of which they are formed
49Metal-insulator semiconductor electrodes
51Insulating materials associated therewith
CPC
H01L 21/0214
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02109characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
02112characterised by the material of the layer
02123the material containing silicon
02126the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
0214the material being a silicon oxynitride, e.g. SiON or SiON:H
H01L 21/02164
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02109characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
02112characterised by the material of the layer
02123the material containing silicon
02164the material being a silicon oxide, e.g. SiO2
H01L 21/02175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02109characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
02112characterised by the material of the layer
02172the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
02175characterised by the metal
H01L 21/02244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02225characterised by the process for the formation of the insulating layer
02227formation by a process other than a deposition process
0223formation by oxidation, e.g. oxidation of the substrate
02244of a metallic layer
H01L 21/02255
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02225characterised by the process for the formation of the insulating layer
02227formation by a process other than a deposition process
02255formation by thermal treatment
H01L 21/02304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02107Forming insulating materials on a substrate
02296characterised by the treatment performed before or after the formation of the layer
02299pre-treatment
02304formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
Applicants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Strasse 53 D-81541 München, DE (AllExceptUS)
  • SCHREMS, Martin [AT/DE]; DE (UsOnly)
  • DRESCHER, Dirk [DE/DE]; DE (UsOnly)
  • WURZER, Helmut [DE/DE]; DE (UsOnly)
  • TEWS, Helmut [DE/US]; US (UsOnly)
Inventors
  • SCHREMS, Martin; DE
  • DRESCHER, Dirk; DE
  • WURZER, Helmut; DE
  • TEWS, Helmut; US
Agents
  • ZIMMERMANN & PARTNER; Postfach 330 920 80069 München, DE
Priority Data
199 01 210.514.01.1999DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) HALBLEITERBAUELEMENT MIT EINER WOLFRAMOXIDSCHICHT UND VERFAHREN ZU DESSEN HERSTELLUNG
(EN) SEMICONDUCTOR ELEMENT WITH A TUNGSTEN OXIDE LAYER AND METHOD FOR ITS PRODUCTION
(FR) COMPOSANT SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION
Abstract
(DE)
Erfindungsgemäß wird ein Halbleiterbauelement mit zumindest einer Schicht aus Wolframoxid (WOx), gegebenenfalls einer strukturierten Schicht aus Wolframoxid (WOx), bereitgestellt. Das erfindungsgemäße Halbleiterbauelement ist dadurch gekennzeichnet, daß die relative Dielektrizitätskonstante ($g(e)r) der Wolframoxidschicht (WOx) größer als 50 ist.
(EN)
The invention relates to a semiconductor element with at least one layer of tungsten oxide (WOx), optionally in a structured tungsten oxide (WOx) layer. The inventive semiconductor element is characterized in that the relative permittivity ($g(e)r) of the tungsten oxide layer (WOx) is higher than 50.
(FR)
L'invention concerne un composant semi-conducteur ayant au moins une couche d'oxyde de tungstène (WOx), éventuellement une couche structurée d'oxyde de tungstène (WOx). Le composant semi-conducteur selon l'invention est caractérisé en ce que la constante diélectrique relative ($g(e)r) de la couche d'oxyde de tungstène (WOx) est supérieure à 50.
Latest bibliographic data on file with the International Bureau