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1. WO2000041448 - ELECTRONIC MODULE CONTAINING COOLING ELEMENTS FOR ELECTRONIC COMPONENTS

Publication Number WO/2000/041448
Publication Date 13.07.2000
International Application No. PCT/CH1998/000563
International Filing Date 30.12.1998
Chapter 2 Demand Filed 17.12.1999
IPC
H05K 7/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/1461
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
1461Slidable card holders; Card stiffeners; Control or display means therefor
H05K 7/20545
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20536for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
20545Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
H05K 7/20727
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20718Forced ventilation of a gaseous coolant
20727within server blades for removing heat from heat source
Applicants
  • ACQIRIS SA [CH/CH]; 18, Chemin des Aulx CH-1228 Plan-les Ouates, CH (AllExceptUS)
  • VITTET, Jean-Pierre [CH/CH]; CH (UsOnly)
  • GOUMAZ Jean-François [CH/CH]; CH (UsOnly)
Inventors
  • VITTET, Jean-Pierre; CH
  • GOUMAZ Jean-François; CH
Agents
  • SAAM, Christophe; Patents & Technology Surveys SA Case postale 1448 CH-2001 Neuchâtel, CH
Priority Data
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) ELECTRONIC MODULE CONTAINING COOLING ELEMENTS FOR ELECTRONIC COMPONENTS
(FR) MODULE ELECTRONIQUE COMPORTANT DES ELEMENTS DE REFROIDISSEMENT DE COMPOSANTS ELECTRONIQUES
Abstract
(EN)
A data acquisition module (1) comprising a coupling board (15) with several electronic components (3, 8) that are mounted on at least one surface of said board. A protective cover (16) mounted opposite said surface covers the electronic components. In order to cool analog-to-digital converters of said module, a piston (41) that is connected to the protective cover (16) is pressed against the upper surface of at least one electronic component (3) in order to establish a thermal bridge between the electronic component and the protective cover. The piston is mounted on a support that is secured to the cover (16). The diameter of the portion (410) of the piston (41) that comes into contact with the electronic component (3) that is to be cooled is smaller than the diameter of the portion (411) of the piston that comes into contact with the support (40) for said piston.
(FR)
Un module d'acquisition de données (1) comprend une carte d'interconnexion (15) avec plusieurs composants électroniques (3, 18) montés sur au moins une face de ladite carte. Un couvercle de protection (16) monté en regard de ladite face recouvre les composants électroniques (3, 18). Afin de refroidir notamment les convertisseurs analogiques-numériques du module, un piston (41) lié au couvercle de protection (16) est appuyé par un ressort (43) contre la face supérieure d'au moins un composant électronique (3), de manière à établir un pont thermique entre ledit composant électronique et ledit couvercle de protection. Le piston est monté dans un support de piston fixé sur le couvercle (16). Le diamètre de la portion (410) du piston (41) en contact avec le composant électronique (3) à refroidir est inférieur au diamètre de la portion (411) du piston en contact avec le support de piston (40).
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