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1. WO2000041299 - DEVICE WITH ACOUSTIC WAVES GUIDED IN A FINE PIEZOELECTRIC MATERIAL FILM BONDED WITH A MOLECULAR BONDING ON A BEARING SUBSTRATE AND METHOD FOR MAKING SAME

Publication Number WO/2000/041299
Publication Date 13.07.2000
International Application No. PCT/FR1999/003239
International Filing Date 21.12.1999
IPC
H03H 3/08 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
H03H 9/02 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
H03H 9/10 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
10Mounting in enclosures
CPC
H03H 3/08
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
H03H 3/10
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
10for obtaining desired frequency or temperature coefficient
H03H 9/02574
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02543Characteristics of substrate, e.g. cutting angles
02574of combined substrates, multilayered substrates, piezo-electrical layers on not-piezo- electrical substrate
H03H 9/02779
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02637Details concerning reflective or coupling arrays
02779Continuous surface reflective arrays
H03H 9/1092
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
05Holders; Supports
10Mounting in enclosures
1064for surface acoustic wave [SAW] devices
1092the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
H03H 9/68
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
66Phase shifters
68using surface acoustic waves
Applicants
  • THOMSON-CSF [FR/FR]; 173, boulevard Haussmann F-75008 Paris, FR (AllExceptUS)
  • WRIGHT, Peter [FR/FR]; FR (UsOnly)
Inventors
  • WRIGHT, Peter; FR
Agents
  • ESSELIN, Sophie; Thomson-CSF Propriété Intellectuelle Dépt. Brevets 13, avenue du Prés. Salvador Allende F-94117 Arcueil Cedex, FR
Priority Data
98/1666130.12.1998FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) DEVICE WITH ACOUSTIC WAVES GUIDED IN A FINE PIEZOELECTRIC MATERIAL FILM BONDED WITH A MOLECULAR BONDING ON A BEARING SUBSTRATE AND METHOD FOR MAKING SAME
(FR) DISPOSITIF A ONDES ACOUSTIQUES GUIDEES DANS UNE FINE COUCHE DE MATERIAU PIEZO-ELECTRIQUE COLLEE PAR UNE COLLE MOLECULAIRE SUR UN SUBSTRAT PORTEUR ET PROCEDE DE FABRICATION
Abstract
(EN)
The invention concerns a surface acoustic wave device comprising a fine piezoelectric material film, a molecular glue layer and a bearing substrate. The fine film constitutes a sound energy guide enabling to increase the performance levels of the device. The invention also concerns methods for making said sound wave device, comprising in particular a step which consists in molecular bonding between a bearing substrate and a piezoelectric substrate, then a step reducing the thickness of the piezoelectric substrate.
(FR)
L'invention concerne un dispositif à ondes de surface comprenant une fine couche de matériau piézo-électrique, une couche de colle moléculaire et un substrat porteur. La fine couche constitue un guide d'énergie acoustique qui permet d'augmenter les performances du dispositif. L'invention concerne également des procédés pour réaliser le dispositif à ondes acoustiques, comprenant notamment une étape de collage moléculaire entre un substrat porteur et un substrat piézo-électrique, puis une étape de réduction d'épaisseur du substrat piézo-électrique.
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