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1. WO2000041241 - VERTICALLY INTEGRATED SEMICONDUCTOR SYSTEM

Publication Number WO/2000/041241
Publication Date 13.07.2000
International Application No. PCT/DE1999/004056
International Filing Date 21.12.1999
Chapter 2 Demand Filed 31.07.2000
IPC
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 25/065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
CPC
H01L 2225/06517
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06517Bump or bump-like direct electrical connections from device to substrate
H01L 2225/06541
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06541Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
H01L 2225/06555
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06555Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
H01L 2225/06572
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06572Auxiliary carrier between devices, the carrier having an electrical connection structure
H01L 23/481
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
481Internal lead connections, e.g. via connections, feedthrough structures
H01L 25/0657
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
0657Stacked arrangements of devices
Applicants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Str. 53 D-81541 München, DE (AllExceptUS)
  • SMOLA, Michael [DE/DE]; DE (UsOnly)
  • KUX, Andreas [DE/DE]; DE (UsOnly)
Inventors
  • SMOLA, Michael; DE
  • KUX, Andreas; DE
Agents
  • INFINEON TECHNOLOGIES AG; Zedlitz, Peter Postfach 22 13 17 D-80503 München, DE
  • Epping Hermann & Fixcher GbR; Postfach 12 10 26 80034 München, DE
Common Representative
  • INFINEON TECHNOLOGIES AG; Zedlitz, Peter Postfach 22 13 17 D-80503 München, DE
Priority Data
198 60 819.530.12.1998DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERTIKAL INTEGRIERTE HALBLEITERANORDNUNG
(EN) VERTICALLY INTEGRATED SEMICONDUCTOR SYSTEM
(FR) ENSEMBLE SEMI-CONDUCTEUR INTEGRE VERTICALEMENT
Abstract
(DE)
Die Erfindung schlägt eine Halbleiteranordnung vor mit zumindest einem Halbleiterchip mit einer ersten und einer zweiten Hauptseite, der auf der ersten und der zweiten Hauptseite aktive Strukturen aufweist, die mittels durch den Halbleiterchip hindurchgehenden Verbindungen miteinander verbunden sind, wobei der zumindest eine Halbleiterchip mit einer der Hauptseiten auf einer ersten Hauptseite eines Trägers angeordnet ist.
(EN)
The invention relates to a semiconductor system which comprises at least one semiconductor chip having a first and a second main side. Said first and second main sides are provided with active structures that are connected to each other by means of interconnections passing through the semiconductor chip. The at least one semiconductor chip is arranged such that one of its main sides rests on a first main side of a support.
(FR)
L'invention concerne un ensemble semi-conducteur comportant au moins une puce de semi-conducteur présentant un premier côté principal et un second côté principal pourvus de structures actives qui sont reliées ensemble par des connexions traversant la puce de semi-conducteur. La ou les puces de semi-conducteur sont disposées de sorte qu'un de leurs côtés principaux repose sur un premier côté principal d'un support.
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