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1. WO2000041240 - VERTICALLY INTEGRATED CIRCUIT SYSTEM

Publication Number WO/2000/041240
Publication Date 13.07.2000
International Application No. PCT/DE1999/004055
International Filing Date 21.12.1999
IPC
G11C 29/00 2006.01
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
29Checking stores for correct operation; Testing stores during standby or offline operation
H01L 23/48 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/556 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
552Protection against radiation, e.g. light
556against alpha rays
H01L 23/58 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
H01L 25/065 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/78
CPC
G11C 29/74
GPHYSICS
11INFORMATION STORAGE
CSTATIC STORES
29Checking stores for correct operation ; ; Subsequent repair; Testing stores during standby or offline operation
70Masking faults in memories by using spares or by reconfiguring
74using duplex memories, i.e. using dual copies
H01L 2225/06513
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06513Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
H01L 2225/06541
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2225Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
06503Stacked arrangements of devices
06541Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
H01L 23/481
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
481Internal lead connections, e.g. via connections, feedthrough structures
H01L 23/556
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
552Protection against radiation, e.g. light ; or electromagnetic waves
556against alpha rays
H01L 23/585
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
585comprising conductive layers or plates or strips or rods or rings
Applicants
  • INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Strasse 53 D-81541 München, DE (AllExceptUS)
  • BADER, Martin [DE/DE]; DE (UsOnly)
  • SMOLA, Michael [DE/DE]; DE (UsOnly)
Inventors
  • BADER, Martin; DE
  • SMOLA, Michael; DE
Common Representative
  • INFINEON TECHNOLOGIES AG; Zedlitz, Peter Postfach 22 13 17 D-80503 München, DE
Priority Data
198 60 817.930.12.1998DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERTIKAL INTEGRIERTE SCHALTUNGSANORDNUNG
(EN) VERTICALLY INTEGRATED CIRCUIT SYSTEM
(FR) ENSEMBLE CIRCUIT INTEGRE VERTICALEMENT
Abstract
(DE)
Es ist eine vertikal integrierte Schaltungsanordnung mit zumindest einer ersten integrierten Schaltung und einer zweiten integrierten Schaltung vorgesehen, die übereinander angeordnet sind. Dabei sind auf beiden integrierten Schaltungen identische Funktionalitäten ausgebildet. Zumindest auf einer der integrierten Schaltungen ist eine Steuereinrichtung vorgesehen, die ein Zusammenarbeiten der Schaltungen mit identischer Funktionalität steuert.
(EN)
The invention relates to a vertically integrated circuit system comprising at least one first integrated circuit and a second integrated circuit which are positioned on top of each other, identical functionalities being configured on the two integrated circuits. At least one of the integrated circuits is provided with a control device which controls the cooperation of the circuits with identical functionalities.
(FR)
L'invention concerne un ensemble circuit intégré verticalement qui comporte au moins un premier circuit intégré et un second circuit intégré qui sont disposés l'un sur l'autre. Sur les deux circuits intégrés sont formées des fonctionnalités identiques. Au moins sur un des circuits intégrés se trouve un dispositif de commande destiné à commander la coopération des circuits avec des fonctionnalités identiques.
Also published as
ININ/PCT/2000/360/KOL
US09651503
Latest bibliographic data on file with the International Bureau