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1. WO2000041222 - APPARATUS FOR PROCESSING WAFERS

Publication Number WO/2000/041222
Publication Date 13.07.2000
International Application No. PCT/US1999/028753
International Filing Date 02.12.1999
Chapter 2 Demand Filed 17.07.2000
IPC
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/67178
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67161characterized by the layout of the process chambers
67178vertical arrangement
H01L 21/67184
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67184characterized by the presence of more than one transfer chamber
Y10S 414/137
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
137including means for charging or discharging wafer cassette
Applicants
  • SILICON VALLEY GROUP, INC. [US/US]; Suite 400 101 Metro Drive San Jose, CA 95110, US (AllExceptUS)
  • PARK, Jae, Heon [US/US]; US (UsOnly)
Inventors
  • PARK, Jae, Heon; US
Agents
  • DAVIS, Paul; Wilson Sonsini Goodrich & Rosati 650 Page Mill Road Palo Alto, CA 94034-1050, US
Priority Data
09/223,11130.12.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS FOR PROCESSING WAFERS
(FR) DISPOSITIF DE FABRICATION DES PLAQUETTES
Abstract
(EN)
Systems and methods are described for wafer processing. A wafer processing apparatus includes: a first wafer transporter; a process station coupled to the first wafer transporter, the process station including: a first plurality of wafer processing stacks, each of the plurality of wafer processing stacks including a plurality of wafer processing modules, and a second wafer transporter coupled to the plurality of wafer processing modules, each of the plurality of wafer processing modules adjacent, and accessible by, the second wafer transporter; and a third wafer transporter coupled to the process station, wherein any of the plurality of wafer processing modules in any of the plurality of wafer processing stacks can be accessed by at least two adjacent wafer transporters from among the first, second and third wafer transporter. The systems and methods provide advantages from minimizing pre-process and/or post-process times, minimizing variation of the pre-process and/or post-process times and reducing robot over utilization.
(FR)
Cette invention concerne des systèmes et des procédés de fabrication de plaquettes. Le dispositif de fabrication comprend :un premier transporteur de plaquettes ; un poste de traitement couplé au premier transporteur, qui comprend une première pluralité de piles de traitement, chacune de ces piles renfermant une pluralité de modules de traitement ; et un second transporteur de plaquettes couplé à la pluralité de modules fabrication des plaquettes, chacun de ces modules se trouvant contre le second transporteur et pouvant être atteint par lui; et un troisième transporteur de plaquettes couplé au poste de fabrication. N'importe lequel de la pluralité des modules de fabrication dans l'une quelconque des piles de fabrication est accessible par au moins deux transporteurs adjacents pris parmi les premier, second et troisième transporteurs. Ces systèmes et procédés offrent divers avantages, notamment ceux de réduire les durées du pré-traitement et/ou du post-traitement ainsi que les écarts entre ces durées, et d'éviter une sur-utilisation de robots.
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