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1. WO2000041217 - METHOD AND APPARATUS FOR PREVENTING WARP OF CLAMP RING USED FOR WAFER COATING APPARATUS

Publication Number WO/2000/041217
Publication Date 13.07.2000
International Application No. PCT/US1999/030673
International Filing Date 22.12.1999
IPC
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
H01L 21/68721
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68721characterised by edge clamping, e.g. clamping ring
H01L 21/68728
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68728characterised by a plurality of separate clamping members, e.g. clamping fingers
Applicants
  • TOKYO ELECTRON LIMITED [JP/JP]; TBS Broadcast Center 3-6, Akasaka 5-chome Minato-ku Tokyo 107, JP
  • TOKYO ELECTRON ARIZONA, INC. [US/US]; 2120 W. Guadalupe Road Gilbert, AZ 85233-8205, US (JP)
Inventors
  • REISS, Ira; US
Agents
  • FREI, Donald, F. ; Wood, Herron & Evans, L.L.P. 2700 Carew Tower Cincinnati, OH 45202, US
Priority Data
09/227,91108.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR PREVENTING WARP OF CLAMP RING USED FOR WAFER COATING APPARATUS
(FR) PROCEDE ET APPAREIL EMPECHANT LE GAUCHISSEMENT D'UN ANNEAU DE FIXATION D'APPAREIL DE REVETEMENT DE TRANCHE
Abstract
(EN)
Warping of a clamping ring, by which a series of semiconductor wafers (17) is held to a wafer holder (10) for vapor deposition of coatings onto the wafers (17), is retarded by providing a clamping ring (12) formed of the material having a coefficient of thermal expansion that is approximately the same as or close to that of the coating material being deposited onto the wafers (17). Preferably, the clamping ring (12) is one having a generally circular opening (24) that is slightly smaller than the wafers (17) to be clamped and that has a flat edge (29) on the inner edge (18) of the ring (12) corresponding to the orientation flat found on the outer edge of an industry standard wafer (17), so that the ring (12) engages the wafer during clamping around the entire outer rim of the wafer (17).
(FR)
Le gauchissement d'un anneau de fixation, qui maintient une série de tranches (17) de semi-conducteur sur un porte-tranches (10), afin de déposer un revêtement par évaporation sous vide sur lesdites tranches (17), est retardé au moyen d'un anneau de fixation (12) formé d'un matériau présentant un coefficient d'expansion thermique approximativement identique ou proche de celui du matériau de revêtement déposé sur les tranches (17). L'anneau de fixation (12), possède, de préférence, une ouverture (24) généralement circulaire légèrement plus petite que les tranches (17) à maintenir, et un rebord plat (29) se trouvant sur le rebord intérieur de l'anneau (18) et correspondant à l'orientation plate du bord extérieur (18) de l'anneau (12) d'une tranche industrielle standard (17), de sorte que ledit anneau (12) vient en contact avec la tranche pendant sa fixation autour de la totalité du bord extérieur de la tranche (17).
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