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1. WO2000040654 - CURABLE RESIN COMPOSITION

Publication Number WO/2000/040654
Publication Date 13.07.2000
International Application No. PCT/JP1999/007367
International Filing Date 28.12.1999
Chapter 2 Demand Filed 27.03.2000
IPC
C08G 65/336 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
32Polymers modified by chemical after-treatment
329with organic compounds
336containing silicon
CPC
C08G 65/336
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
65Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
02from cyclic ethers by opening of the heterocyclic ring
32Polymers modified by chemical after-treatment
329with organic compounds
336containing silicon
Applicants
  • KANEKA CORPORATION [JP/JP]; 2-4, Nakanoshima 3-chome, Kita-ku Osaka-shi, Osaka 530-8288, JP (AllExceptUS)
  • ITO, Hiroshi [JP/JP]; JP (UsOnly)
  • ODAKA, Hidetoshi [JP/JP]; JP (UsOnly)
  • JYONO, Hideharu [JP/JP]; JP (UsOnly)
  • IWAKIRI, Hiroshi [JP/JP]; JP (UsOnly)
  • KAWAKUBO, Fumio [JP/JP]; JP (UsOnly)
Inventors
  • ITO, Hiroshi; JP
  • ODAKA, Hidetoshi; JP
  • JYONO, Hideharu; JP
  • IWAKIRI, Hiroshi; JP
  • KAWAKUBO, Fumio; JP
Agents
  • YASUTOMI, Yasuo ; Chuo Building 4-20, Nishinakajima 5-chome Yodogawa-ku Osaka-shi Osaka 532-0011, JP
Priority Data
11/64505.01.1999JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE RESIN COMPOSITION
(FR) COMPOSITION DE RESINE DURCISSABLE
Abstract
(EN)
A novel curable composition having sufficient mechanical strength, bonding strength, rubber elasticity, and workability; and a method of direct glazing with this composition. The curable resin composition comprises: (I) a polyether oligomer which contains reactive silicon groups and in which each silicon group is present at an end of the molecular chain and the proportion of the molecular chain ends having the reactive silicon groups is 85 % or more as determined by 1H-NMR spectrometry; and (II) a reinforcing filler. The direct glazing method comprises using the curable resin composition as a sealing material to directly fix a glass member to a vehicle.
(FR)
Cette invention, qui a trait à une nouvelle composition de résine durcissable faisant montre de qualités suffisantes de résistance mécanique, de résistance au liage, ayant l'élasticité du caoutchouc et apte au façonnage, concerne également une technique d'enduisage direct à l'aide de ladite composition. La composition de résine durcissable comprend, (I), un oligomère de polyéther contenant des groupes silicium réagissants, chaque groupe silicium étant présent sur une extrémité de la chaîne moléculaire et la proportion des extrémités des chaînes moléculaires portant les groupes silicium réagissants étant de 80 % ou davantage, comme déterminé par une spectrométrie 1H-NMR, et (II), une matière de charge de renfort. La technique d'enduisage direct consiste à utiliser cette composition de résine durcissable comme matériau d'étanchéité pour fixer directement un élément de glace sur un véhicule.
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