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1. WO2000040408 - METHOD OF MASS PRODUCING AND PACKAGING INTEGRATED OPTICAL SUBSYSTEMS

Publication Number WO/2000/040408
Publication Date 13.07.2000
International Application No. PCT/US2000/000241
International Filing Date 07.01.2000
Chapter 2 Demand Filed 25.07.2000
IPC
B29C 65/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
B29C 65/48 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining of preformed parts; Apparatus therefor
48using adhesives
G11B 7/12 2012.01
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
12Heads, e.g. forming of the optical beam spot or modulation of the optical beam
G11B 7/22 2006.01
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
12Heads, e.g. forming of the optical beam spot or modulation of the optical beam
22Apparatus or processes for the manufacture of optical heads, e.g. assembly
G11B 7/135 2012.01
GPHYSICS
11INFORMATION STORAGE
BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
12Heads, e.g. forming of the optical beam spot or modulation of the optical beam
135Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
CPC
B29C 65/483
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
48using adhesives ; , i.e. using supplementary joining material; solvent bonding
4805characterised by the type of adhesives
483Reactive adhesives, e.g. chemically curing adhesives
B29C 65/4845
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
48using adhesives ; , i.e. using supplementary joining material; solvent bonding
4805characterised by the type of adhesives
483Reactive adhesives, e.g. chemically curing adhesives
4845Radiation curing adhesives, e.g. UV light curing adhesives
B29C 66/1122
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
66General aspects of processes or apparatus for joining preformed parts
01General aspects dealing with the joint area or with the area to be joined
05Particular design of joint configurations
10particular design of the joint cross-sections
11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
112Single lapped joints
1122Single lap to lap joints, i.e. overlap joints
B29C 66/342
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
66General aspects of processes or apparatus for joining preformed parts
01General aspects dealing with the joint area or with the area to be joined
342Preventing air-inclusions
B29C 66/452
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
66General aspects of processes or apparatus for joining preformed parts
40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
41Joining substantially flat articles
45Joining of substantially the whole surface of the articles
452the article having a disc form, e.g. making CDs or DVDs
B29C 66/71
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
66General aspects of processes or apparatus for joining preformed parts
70characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
71characterised by the composition of the plastics material of the parts to be joined
Applicants
  • DIGITAL OPTICS CORPORATION [US/US]; Suite J 5900 Northwoods Parkway Charlotte, NC 28259, US (AllExceptUS)
  • FELDMAN, Michael, R. [US/US]; US (UsOnly)
  • KATHMAN, Alan [US/US]; US (UsOnly)
Inventors
  • FELDMAN, Michael, R.; US
  • KATHMAN, Alan; US
Agents
  • MORSE, Susan, S.; Jones Volentine, LLP Suite 150 12200 Sunrise Valley Drive Reston, VA 20191, US
Priority Data
09/227,53108.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF MASS PRODUCING AND PACKAGING INTEGRATED OPTICAL SUBSYSTEMS
(FR) PROCEDE DE PRODUCTION DE MASSE ET D'EMBALLAGE DE SOUS-SYSTEMES OPTIQUES INTEGRES
Abstract
(EN)
Mass production of integrated optical subsystems may be realized by providing a bonding material surround each die in an array of first dies on a wafer. A plurality of second dies are then aligned with the dies on the wafer. The bonding material is then treated to bond the aligned dies. The bonded dies are then diced to form a bonded pair of dies containing at least one optical element, thus forming an integrated optical subsystem. The bonding material may be provided over at least part of the optical path of each first die, over an entire surface of the wafer or around the perimeter of each first die. The second dies may be provided on another wafer. Either die may contain active elements, e.g., a laser or a detector. The optical elements may be formed in the die or may be of a different material than that of the die.
(FR)
L'invention concerne la production de masse de sous-systèmes optiques, pouvant s'obtenir grâce à un matériau de liaison qui entoure chaque dé d'un premier ensemble de dés sur une plaquette, sur laquelle un second ensemble de dés est ensuite aligné avec le premier. Le matériau de liaison est par la suite traité de façon à lier les dés alignés, lesquels sont alors coupés en dés de façon à former une paire de dés liés contenant au moins un élément optique, formant ainsi un sous-système optique intégré. Le matériau de liaison peut recouvrir au moins une partie du trajet optique de chaque dé du premier ensemble, une surface entière de la plaquette ou le pourtour de chaque dé du premier ensemble. Une autre plaquette peut recevoir les dés du second ensemble. Les deux ensembles de dés peuvent comporter des éléments actifs, tels qu'un laser ou un détecteur. Les éléments optiques peuvent être formés dans le dé ou peuvent être d'un matériau différent de celui du dé.
Also published as
Latest bibliographic data on file with the International Bureau