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1. WO2000040343 - APPARATUS AND METHOD FOR APPLYING FLUX TO A SUBSTRATE

Publication Number WO/2000/040343
Publication Date 13.07.2000
International Application No. PCT/US2000/000427
International Filing Date 07.01.2000
Chapter 2 Demand Filed 07.08.2000
IPC
B23K 1/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
G03F 7/12 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
12Production of screen printing forms or similar printing forms, e.g. stencils
H05K 3/12 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using printing techniques to apply the conductive material
CPC
B23K 1/203
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
203Fluxing, i.e. applying flux onto surfaces
G03F 7/12
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
12Production of screen printing forms or similar printing forms, e.g. stencils
H05K 3/1225
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12using ; thick film techniques, e.g.; printing techniques to apply the conductive material ; or similar techniques for applying conductive paste or ink patterns
1216by screen printing or stencil printing
1225Screens or stencils; Holders therefor
Applicants
  • PROVENCHER, Timothy, J. [US/US]; US
  • WOUDSTRA, Harrie [US/US]; US
Inventors
  • PROVENCHER, Timothy, J.; US
  • WOUDSTRA, Harrie; US
Agents
  • SULLIVAN, Stephen, T.; Sullivan Law Group Suite 120 5060 North 40th Street Phoenix, AZ 85018-2140, US
Priority Data
09/227,24307.01.1999US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS AND METHOD FOR APPLYING FLUX TO A SUBSTRATE
(FR) DISPOSITIF ET PROCEDE PERMETTANT D'APPLIQUER DU FLUX A UN SUBSTRAT
Abstract
(EN)
An apparatus and method is provided for applying a liquid solder flux in a pattern to a substrate. A stencil is utilized which comprises first apertures (16) corresponding in location to the pattern and second apertures (32) in fluid communication with the first apertures, the second apertures being disposed adjacent an upper surface of the substrate. The first apertures are disposed in a first section (26) of the stencil and the second apertures are disposed in a second section (28) of the stencil. The first section (26) and the second section (28) meet at a planar intersection substantially parallel to first and second sides of the stencil. The planar intersection has a cross section different from that of the first and second sections.
(FR)
L'invention concerne un dispositif et un procédé permettant d'appliquer sur un substrat un flux de brasage liquide selon un motif. On utilise un pochoir comprenant des premières ouvertures (16) correspondant à la position du motif et des secondes ouvertures (32), en communication fluide avec les premières, et qui sont adjacentes à une surface supérieure du substrat. Les premières ouvertures sont situées dans une première section (26) du pochoir, les secondes ouvertures étant situées dans une seconde section (28) de celui-ci. La première section (26) et la seconde section (28) se rencontrent au niveau d'une intersection plane sensiblement parallèle aux premier et second côtés du pochoir. La coupe transversale de cette intersection plane est différente de celles de la première et de la seconde section.
Also published as
Latest bibliographic data on file with the International Bureau