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1. WO2000039850 - ELECTRONIC POWER CIRCUIT WITH HEAT DISSIPATING RADIATOR

Considered void:  24.01.2001
Publication Number WO/2000/039850
Publication Date 06.07.2000
International Application No. PCT/FR1999/002439
International Filing Date 11.10.1999
Chapter 2 Demand Filed 03.07.2000
IPC
H01L 21/60 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/68 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
H01L 21/98 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
98Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices
CPC
H01L 21/6835
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
H01L 2224/2919
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
28Structure, shape, material or disposition of the layer connectors prior to the connecting process
29of an individual layer connector
29001Core members of the layer connector
29099Material
2919with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/83192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
8319Arrangement of the layer connectors prior to mounting
83192wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
H01L 2224/83801
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
838Bonding techniques
83801Soldering or alloying
H01L 2224/85001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
85001involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
Applicants
  • ALSTOM [FR/FR]; 25 avenue Kléber F-75116 Paris, FR (AllExceptUS)
  • RENAULT, Christian [FR/FR]; FR (UsOnly)
  • MARTIN, Nathalie [FR/FR]; FR (UsOnly)
Inventors
  • RENAULT, Christian; FR
  • MARTIN, Nathalie; FR
Agents
  • MONCHENY, Michel; Cabinet Lavoix 2, place d'Estiennes d'Orves F-75441 Paris Cedex 09, FR
Priority Data
98/1650028.12.1998FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) ELECTRONIC POWER CIRCUIT WITH HEAT DISSIPATING RADIATOR
(FR) CIRCUIT ELECTRONIQUE DE PUISSANCE AVEC UN RADIATEUR DE DISSIPATION THERMIQUE
Abstract
(EN)
The invention concerns an electronic power circuit comprising at least an electronic power chip (2, 3), a heat dissipating radiator (4) having passages for circulating a liquid coolant, and a substrate (10) whereon the chip is brazed and which is arranged between the radiator (4) and the chip (2, 3). The radiator (4) comprises a base plate (6), made in electrically insulating ceramics, the base plate (6) having channels emerging in a first surface. The radiator further comprises a closure element (7) directly mounted on the first surface of the base plate for defining, with the channels, passages circulating the liquid coolant. The invention is useful for producing power converters for railway vehicles. (Fig. 1)
(FR)
Ce circuit électronique de puissance comprend au moins une puce électronique de puissance (2, 3), un radiateur (4) de dissipation thermique présentant des passages de circulation d'un fluide caloporteur, et un substrat (10) sur lequel la puce est brasée et qui est disposé entre le radiateur (4) et la puce (2, 3). Le radiateur (4) comprend une semelle (6), réalisée en céramique électriquement isolante, la semelle (6) présentant des canaux débouchant dans une première de ses faces. Le radiateur comprend en outre un élément de fermeture (7) rapporté sur la première face de la semelle pour délimiter, avec les canaux, les passages de circulation du fluide caloporteur. Application à réalisation de convertisseurs de puissance pour véhicules ferroviaires. (Fig. 1)
Also published as
Latest bibliographic data on file with the International Bureau