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1. WO2000039841 - METHOD FOR STORING CARRIER FOR POLISHING WAFER

Publication Number WO/2000/039841
Publication Date 06.07.2000
International Application No. PCT/US1999/029078
International Filing Date 08.12.1999
Chapter 2 Demand Filed 24.05.2000
IPC
B08B 17/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
17Methods preventing fouling
B24B 37/27 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
27Work carriers
B24B 37/28 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
27Work carriers
28for double side lapping of plane surfaces
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
B24B 37/345
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
34Accessories
345Feeding, loading or unloading work specially adapted to lapping
H01L 21/6704
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
Applicants
  • MEMC ELECTRONIC MATERIALS, INC. [US/US]; 501 Pearl Drive P.O. Box 8 St. Peters, MO 63376, US (AllExceptUS)
  • IKEDA, Masaaki [JP/JP]; US (UsOnly)
  • YOSHIMURA, Ichiro [JP/JP]; US (UsOnly)
Inventors
  • IKEDA, Masaaki; US
  • YOSHIMURA, Ichiro; US
Agents
  • HEJLEK, Edward, J.; Senniger, Powers, Leavitt & Roedel 16th floor One Metropolitan Square St. Louis, MO 63102, US
Priority Data
10-36687324.12.1998JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR STORING CARRIER FOR POLISHING WAFER
(FR) ENTREPOSAGE D'UN SUPPORT SERVANT AU POLISSAGE DE PLAQUETTES
Abstract
(EN)
To provide a method for storing a carrier (3) for polishing a silicon wafer, which can store the carrier (3) in a manner to reduce scratches on the silicon wafer. The method includes storing a carrier (3) for use in polishing a silicon wafer completely immersed in a liquid. At least a substantial portion of the liquid is deionized water.
(FR)
L'invention concerne un procédé d'entreposage d'un support (3) destiné au polissage d'une plaquette au silicium, permettant d'entreposer ledit support (3) de manière à réduire les égratignures sur la plaquette de silicium. Ce procédé consiste à entreposer ledit support (3) destiné au polissage d'une plaquette de silicium en immersion totale dans un liquide constitué au moins en grande partie d'eau désionisée.
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