Processing

Please wait...

Settings

Settings

1. WO2000039837 - PERFORATED PLASMA CONFINEMENT RING IN PLASMA REACTORS

Publication Number WO/2000/039837
Publication Date 06.07.2000
International Application No. PCT/US1999/030739
International Filing Date 22.12.1999
Chapter 2 Demand Filed 26.07.2000
IPC
H01J 37/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes
CPC
H01J 37/32165
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32082Radio frequency generated discharge
32137controlling of the discharge by modulation of energy
32155Frequency modulation
32165Plural frequencies
H01J 37/32623
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32431Constructional details of the reactor
32623Mechanical discharge control means
Y10S 156/915
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
156Adhesive bonding and miscellaneous chemical manufacture
915Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus
Applicants
  • LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538-6470, US
Inventors
  • LI, Lumin; US
  • MUELLER, George; US
Agents
  • NGUYEN, Joseph, A.; Beyer & Weaver LLP P.O. Box 61059 Palo Alto, CA 94306, US
  • LEE, Michael; Beyer Weaver & Thomas, Llp Post Office 130 Mountain View, CA 94040, US
Priority Data
09/222,58828.12.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PERFORATED PLASMA CONFINEMENT RING IN PLASMA REACTORS
(FR) ANNEAU DE CONFINEMENT DU PLASMA PERFORE, DANS DES REACTEURS A PLASMA
Abstract
(EN)
The invention relates to a plasma processing reactor apparatus for semiconductor processing a substrate. The apparatus includes a chamber. The apparatus further includes a top electrode configured to be coupled to a first RF power source having a first RF frequency and a bottom electrode configured to be coupled to second RF power source having a second RF frequency that is lower than the first RF frequency. The apparatus additionally includes an insulating shroud that lines an interior of the chamber, the insulating shroud being configured to be electrically floating during the processing. The apparatus further includes a perforated plasma confinement ring disposed outside of an outer periphery of the bottom electrode, a top surface of the perforated plasma confinement ring being disposed below a top surface of the substrate and electrically grounded during the processing.
(FR)
L'invention concerne un appareil à réacteur de traitement au plasma, pour le traitement de semi-conducteurs d'un substrat. Ledit appareil comporte une chambre, une électrode supérieure configurée pour être couplée à une première source d'énergie radioélectrique possédant une première fréquence radioélectrique, et une électrode inférieure configurée pour être couplée à une deuxième source d'énergie radioélectrique possédant une deuxième fréquence inférieure à la première. Ledit appareil comporte de plus une enveloppe isolante qui double l'intérieur de la chambre et qui est configurée pour flotter électriquement pendant le traitement. Il est doté d'un anneau de confinement de plasma placé à l'extérieur de la périphérie extérieure de l'électrode inférieure, une surface supérieure de l'anneau perforé de confinement de plasma étant placée au-dessous d'une surface supérieure du substrat et étant reliée à la terre pendant le traitement.
Latest bibliographic data on file with the International Bureau