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1. WO2000039829 - METHOD FOR PRECISE MOLDING AND ALIGNMENT OF STRUCTURES ON A SUBSTRATE USING A STRETCHABLE MOLD

Publication Number WO/2000/039829
Publication Date 06.07.2000
International Application No. PCT/US1999/007145
International Filing Date 31.03.1999
Chapter 2 Demand Filed 08.03.2000
IPC
H01J 9/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
9Apparatus or processes specially adapted for the manufacture of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
24Manufacture or joining of vessels, leading-in conductors, or bases
CPC
B29C 33/303
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
30Mounting, exchanging or centering
303centering mould parts or halves, e.g. during mounting
B29C 33/40
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
38characterised by the material or the manufacturing process
40Plastics, e.g. foam or rubber
B29C 33/424
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33Moulds or cores; Details thereof or accessories therefor
42characterised by the shape of the moulding surface, e.g. ribs or grooves
424Moulding surfaces provided with means for marking or patterning
H01J 2211/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2211Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
20Constructional details
34Vessels, containers or parts thereof, e.g. substrates
36Spacers, barriers, ribs, partitions or the like
H01J 2217/49
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
2217Gas-filled discharge tubes
38Cold-cathode tubes
49Display panels, e.g. not making use of alternating current
H01J 9/241
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
9Apparatus or processes specially adapted for the manufacture, ; installation, removal, maintenance; of electric discharge tubes, discharge lamps, or parts thereof
24Manufacture or joining of vessels, leading-in conductors or bases
241the vessel being for a flat panel display
Applicants
  • MINNESOTA MINING AND MANUFACTURING COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427, US
Inventors
  • CHIU, Raymond, C.; US
  • HOOPMAN, Timothy, L.; US
  • HUMPAL, Paul, E.; US
  • KING, Vincent, W.; US
  • DILLON, Kenneth, R.; US
Agents
  • GWIN, H., Sanders, Jr. ; Minnesota Mining and Manufacturing Company Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427, US
  • MEYERS, Hans-Wilhelm; P.O. Box 102241 D-50462 Koln, DE
Priority Data
09/219,80323.12.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR PRECISE MOLDING AND ALIGNMENT OF STRUCTURES ON A SUBSTRATE USING A STRETCHABLE MOLD
(FR) PROCEDE DE MOULAGE PRECIS ET ALIGNEMENT DE STRUCTURE SUR UN SUBSTRAT A L'AIDE D'UN MOULE ETIRABLE
Abstract
(EN)
A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardered between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to removed the binder and optimally fired to sinter the ceramic powder.
(FR)
L'invention concerne un procédé de moulage et d'alignement de microstructure sur un substrat à motifs à l'aide d'un moule microstructuré. Une suspension aqueuse contenant un mélange de poudre céramique et de liant fugace durcissable est placé entre la microstructure d'un moule étirable et un substrat à motifs. Le moule peut être étiré de manière à aligner la microstructure du moule sur une partie prédéterminée du substrat à motifs. La suspension aqueuse est durcie entre le moule et le substrat. Le moule est alors retiré pour que les microstructures se collent au substrat et soient alignées sur les motifs du substrat. Les microstructures peuvent être chauffées de manière à éliminer le liant et éventuellement cuites afin de fritter la poudre céramique.
Latest bibliographic data on file with the International Bureau