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1. WO2000039216 - CYANATE-EPOXY RESIN COMPOSITION, AND PREPREG, METAL FOIL-LAMINATED PLATE AND PRINTED WIRING BOARD USING THE SAME

Publication Number WO/2000/039216
Publication Date 06.07.2000
International Application No. PCT/JP1999/007227
International Filing Date 22.12.1999
Chapter 2 Demand Filed 30.06.2000
IPC
B32B 15/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
C08G 59/40 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40characterised by the curing agents used
H05K 1/03 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is next to another layer of the same or of a different material
08of synthetic resin
B32B 15/14
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
14next to a fibrous or filamentary layer
B32B 2260/021
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2260Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
02Composition of the impregnated, bonded or embedded layer
021Fibrous or filamentary layer
B32B 2260/046
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2260Impregnation or embedding of a layer; Bonding a fibrous, filamentary or particulate layer by using a binder
04Impregnation material
046Synthetic resin
B32B 2457/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2457Electrical equipment
08PCBs, i.e. printed circuit boards
C08G 59/4014
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
40characterised by the curing agents used
4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
4014Nitrogen containing compounds
Applicants
  • HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 163-0449, JP (AllExceptUS)
  • TOMIOKA, Kenichi [JP/JP]; JP (UsOnly)
  • TAKANO, Nozomu [JP/JP]; JP (UsOnly)
  • FUKUDA, Tomio [JP/JP]; JP (UsOnly)
  • MIYATAKE, Masato [JP/JP]; JP (UsOnly)
  • MIZUNO, Yasuyuki [JP/JP]; JP (UsOnly)
Inventors
  • TOMIOKA, Kenichi; JP
  • TAKANO, Nozomu; JP
  • FUKUDA, Tomio; JP
  • MIYATAKE, Masato; JP
  • MIZUNO, Yasuyuki; JP
Agents
  • ASAMURA, Kiyoshi ; Room 331 New Ohtemachi Building 2-1, Ohtemachi 2-chome Chiyoda-ku Tokyo 100-0004, JP
Priority Data
10/36594724.12.1998JP
10/36594824.12.1998JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CYANATE-EPOXY RESIN COMPOSITION, AND PREPREG, METAL FOIL-LAMINATED PLATE AND PRINTED WIRING BOARD USING THE SAME
(FR) COMPOSITION DE CYANATE ET DE RESINE EPOXY, ET PREIMPREGNE, PLAQUE STRATIFIEE EN PAPIER METALLIQUE ET CARTE DE CIRCUIT IMPRIME UTILISANT CETTE COMPOSITION
Abstract
(EN)
A cyanate-epoxy resin composition comprising (A) a cyanate type compound containing two or more cyanato groups in one molecule thereof, (B) an epoxy resin, and (C) a curing accelerator system as main components, wherein the epoxy resin is derived from a dicyclopentadiene-phenol polyaddition product having a cyclopentadiene skeleton and the curing accelerator system comprises both a compound having the function to accelerate the curing reaction of the above (A) and a compound having the function to accelerate the curing reaction of the above (B). The resin composition is excellent in glass transition temperature, dielectric characteristics, heat resistance and the property of low susceptibility to water, and can be effectively used for preparing a prepreg and for manufacturing a laminate, a metal foil-laminated plate and a printed wiring board using the prepreg.
(FR)
Cette invention se rapporte à une composition de cyanate et de résine époxy, qui comprend comme constituants principaux : (A) un composé de type cyanate contenant au moins deux groupes cyanato dans l'une de ses molécules ; (B) une résine époxy ; et (C) un système accélérateur de durcissement. La résine époxy est dérivée d'un produit de polyaddition de dicyclopentadiène-phénol ayant un squelette cyclopentadiène et le système accélérateur de durcissement comprend à la fois un composé ayant la capacité d'accélérer la réaction de durcissement du constituant (A) et un composé ayant la capacité d'accélérer la réaction de durcissement du constituant (B). Cette composition de résine possède d'excellentes caractéristiques quant à sa température de transition vitreuse, son pouvoir diélectrique, sa résistance à la chaleur et sa propriété de faible susceptibilité à l'eau, et elle peut être utilisée efficacement pour préparer un préimprégné et pour fabriquer un stratifié, une plaque stratifiée en feuilles métalliques et une carte à circuit imprimé utilisant ce préimprégné.
Also published as
US09856973
Latest bibliographic data on file with the International Bureau