Processing

Please wait...

Settings

Settings

1. WO2000039189 - ELECTRONIC CIRCUIT DEVICE COMPRISING AN EPOXY-MODIFIED AROMATIC VINYL-CONJUGATED DIENE BLOCK COPOLYMER

Publication Number WO/2000/039189
Publication Date 06.07.2000
International Application No. PCT/US1999/021592
International Filing Date 16.09.1999
Chapter 2 Demand Filed 12.05.2000
IPC
C08G 59/34 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20characterised by the epoxy compounds used
32Epoxy compounds containing three or more epoxy groups
34obtained by epoxidation of an unsaturated polymer
C08L 63/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
08Epoxidised polymerised polyenes
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
CPC
C08G 59/027
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
02Polycondensates containing more than one epoxy group per molecule
027obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
C08L 63/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
08Epoxidised polymerised polyenes
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H05K 3/386
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
386by the use of an organic polymeric bonding layer, e.g. adhesive
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427, US
Inventors
  • CLOUGH, Robert, S.; US
Agents
  • DAHL, Philip, Y. ; 3M Innovative Properties Company Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427, US
  • Vossius & Partner (No.31); P.O.Box 86 07 67 81634 Munchen, DE
Priority Data
09/219,26523.12.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTRONIC CIRCUIT DEVICE COMPRISING AN EPOXY-MODIFIED AROMATIC VINYL-CONJUGATED DIENE BLOCK COPOLYMER
(FR) DISPOSITIF DE CIRCUIT ELECTRONIQUE COMPRENANT UN COPOLYMERE SEQUENCE DIENIQUE CONJUGUE A UN COMPOSE VINYLIQUE AROMATIQUE MODIFIE EPOXY
Abstract
(EN)
An elecronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin composition from its substrate under conditions of 85 °C and 85 % relative humidity for 168 hours followed by a temperature of 220 °C for 10 to 40 seconds.
(FR)
L'invention concerne un dispositif de circuit électronique comprenant une composition de résine contenant entre 90 et 100 % en poids d'un copolymère durcissable séquencé diénique conjugué à un composé vinylique aromatique modifié époxy, éventuellement jusqu'à 10 % en poids d'une résine époxy et une quantité efficace d'un durcisseur époxy, le poids en % du copolymère et de la résine époxy étant tributaire du poids du matériau porteur de l'époxy à l'exclusion du durcisseur. La composition de résine peut être utilisée comme adhésif, revêtement ou agent d'encapsulation électronique. Le dispositif de circuit électronique présente une sensibilité réduite à la chaleur et à l'humidité. En outre, le substrat de la composition de résine durcie ne présente pas de vides ni de délamination à une température comprise entre 85 °C et à une humidité relative de 85 % pendant 168 heures suivie d'une température comprise entre 220 °C pendant 10 à 40 secondes.
Latest bibliographic data on file with the International Bureau