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1. WO2000036644 - DEVICE FOR PROCESSING WAFER

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Publication Number WO/2000/036644
Publication Date 22.06.2000
International Application No. PCT/JP1999/006998
International Filing Date 13.12.1999
IPC
H01L 21/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/67057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67057with the semiconductor substrates being dipped in baths or vessels
Applicants
  • TOHO KASEI LTD. [JP]/[JP] (AllExceptUS)
  • DAIKIN INDUSTRIES, LTD. [JP]/[JP] (AllExceptUS)
  • MAEDA, Norio [JP]/[JP] (UsOnly)
  • OONO, Masao [JP]/[JP] (UsOnly)
  • AIHARA, Hiroshi [JP]/[JP] (UsOnly)
Inventors
  • MAEDA, Norio
  • OONO, Masao
  • AIHARA, Hiroshi
Agents
  • TSUGAWA, Tomoo
Priority Data
10/35259311.12.1998JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) DEVICE FOR PROCESSING WAFER
(FR) DISPOSITIF DE TRAITEMENT DE PLAQUETTES
front page image
Abstract
(EN)
A device for processing wafers comprises a process tank (1), an outer tank (2) capable of completely enclosing the process tank (1), a first support member (4) for supporting wafers (3) upright and transferring them to and from the process tank (1), and a second support member (5) capable of moving up and down in the process tank (1) and transferring wafers (3) to and from the first support member (4). The surfaces of wafers can be treated smoothly and evenly.
(FR)
L'invention concerne un dispositif de traitement de plaquettes, comprenant un bac (1) de traitement, un bac (2) extérieur pouvant renfermer complètement le bac (1) de traitement, un premier élément (4) de support destiné au support vertical des plaquettes (3) et à leur transfert vers/hors du bac (1) de traitement, et un second élément (5) de support, mobile vers le haut et vers le bas dans le bac (1) de traitement, assurant le transfert des plaquettes (3) vers/hors du premier élément (4) de support. La surface des plaquettes peut ainsi être traitée en douceur et de manière uniforme.
Also published as
EP1045439
JP2000183134
KR1020010040938
US6589386
Latest bibliographic data on file with the International Bureau
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