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1. WO2000035258 - MULTILAYERED SWITCHING PLATE

Publication Number WO/2000/035258
Publication Date 15.06.2000
International Application No. PCT/RU1999/000053
International Filing Date 01.03.1999
Chapter 2 Demand Filed 27.04.2000
IPC
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H01L 23/49827
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L 23/5385
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5385Assembly of a plurality of insulating substrates
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 2201/09536
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
H05K 2201/096
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
095Conductive through-holes or vias
096Vertically aligned vias, holes or stacked vias
H05K 2201/09827
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
09827Tapered, e.g. tapered hole, via or groove
Applicants
  • TARAN, Alexandr Ivanovich [RU]/[RU]
  • LJUBIMOV, Viktor Konstantinovich [RU]/[RU] (UsOnly)
Inventors
  • TARAN, Alexandr Ivanovich
  • LJUBIMOV, Viktor Konstantinovich
Agents
  • ZYL, Valery Petrovich
Priority Data
9812177208.12.1998RU
Publication Language Russian (RU)
Filing Language Russian (RU)
Designated States
Title
(EN) MULTILAYERED SWITCHING PLATE
(FR) PLAQUE DE COMMUTATION MULTICOUCHES
Abstract
(EN)
The present invention relates to the development and the production of apparatus based on microelectronic components and semiconductor devices, and may widely be used in the production of multilayered printed-circuit cards and of switching structures for monocrystalline modules. The multilayered switching structure of the present invention comprises a plurality of layers of a dielectric material which include electroconductive tracks on their surfaces and which consist of switching layers (1, 2, 3). This structure also includes contact nodes (4, 5) consisting of metallised contacts which are aligned with each other and which are electrically and mechanically connected together by an electroconductive binding material (11, 14). The contact nodes are made in the form of splices arranged between the contacts. In a second embodiment, the multilayered switching plate is characterised in that the electroconductive tracks are provided on both sides of each switching layer (1, 2) and are connected together within the limits of each layer by metallised junction openings (21, 19).
(FR)
Cette invention se rapporte à l'élaboration et à la production d'appareils comprenant des composants micro-électroniques et des dispositifs à semiconducteurs, et peut être utilisée à grande échelle dans la production de cartes de circuits imprimés multicouches et de structures de commutation pour modules monocristallins. Cette structure de commutation multicouches comprend des couches faites d'un matériau diélectrique qui comportent des pistes conductrices de courant sur leurs surfaces, et qui consistent en des couches de commutation (1, 2, 3). Cette structure comprend également des noeuds de contact (4, 5) consistant en des contacts métallisés qui sont alignés les uns par rapport aux autres, et qui sont connectés entre eux par voie électrique et mécanique à l'aide d'un matériau liant et électroconducteur (11, 14). Les noeuds de contact se présentent sous forme d'épissures disposées entre les contacts. Dans un second mode de réalisation, cette plaque de commutation multicouches se caractérise en ce que les pistes électroconductrices sont disposées sur les deux côtés de chaque couche de commutation (1, 2), et sont liées entre elles dans les limites de chaque couche par des ouvertures de jonction métallisées (21, 19).
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