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1. WO2000034830 - PHOTOCURABLE ANISOTROPICALLY CONDUCTIVE COMPOSITION AND ANISOTROPICALLY CONDUCTIVE PATTERN FORMED BY USING THE SAME

Publication Number WO/2000/034830
Publication Date 15.06.2000
International Application No. PCT/JP1999/006855
International Filing Date 07.12.1999
Chapter 2 Demand Filed 09.06.2000
IPC
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
H05K 3/30 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/36 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
CPC
G03F 7/0047
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
0047characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
H05K 2201/10977
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10613Details of electrical connections of non-printed components, e.g. special leads
10954Other details of electrical connections
10977Encapsulated connections
H05K 2203/0514
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
05Patterning and lithography; Masks; Details of resist
0502Patterning and lithography
0514Photodevelopable thick film, e.g. conductive or insulating paste
H05K 3/305
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
305Affixing by adhesive
H05K 3/321
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
321by conductive adhesives
H05K 3/361
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
36Assembling printed circuits with other printed circuits
361Assembling flexible printed circuits with other printed circuits
Applicants
  • TAIYO INK MANUFACTURING CO., LTD. [JP]/[JP] (AllExceptUS)
  • SASAKI, Masaki [JP]/[JP] (UsOnly)
  • ARIMA, Masao [JP]/[JP] (UsOnly)
  • SHIOZAWA, Naoyuki [JP]/[JP] (UsOnly)
Inventors
  • SASAKI, Masaki
  • ARIMA, Masao
  • SHIOZAWA, Naoyuki
Agents
  • YOSHIDA, Shigeki
Priority Data
10/34877108.12.1998JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOCURABLE ANISOTROPICALLY CONDUCTIVE COMPOSITION AND ANISOTROPICALLY CONDUCTIVE PATTERN FORMED BY USING THE SAME
(FR) COMPOSITION PHOTODURCISSABLE A CONDUCTION ANISOTROPE ET MOTIF A CONDUCTION ANISOTROPE FORME AU MOYEN DE LADITE COMPOSITION
Abstract
(EN) A photocurable anisotropically conductive composition which comprises (A) a carboxyl group-containing resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator and (D) electrically conductive particles, and preferably (E) an epoxy compound having two or more epoxy groups in a molecule thereof as a thermosetting component, and which is capable of forming an anisotropically conductive film which is interposed between terminals to be connected to one another to electrically connect them and of being developed by an alkaline aqueous solution. For example, when TAB and ITO terminals in a liquid crystal display are connected, the above composition is coated only on the terminals to be connected of ITO electrodes (2) formed on the glass substrate (1) of a liquid crystal panel, and then, dried, exposed to a light, and developed, to thereby form anisotropically conductive patterns (10) only on the electrodes. Subsequently, respective wiring patterns (6) of TAB (5) are overlapped on the anisotropically conductive patterns (10) and then they are crimped under irradiation of ultraviolet rays, to thereby be bound together and cured. These composition, pattern and method for connection can be used for securing the conductivity at a connection point without detriment to the electrical insulation between adjacent wiring lines.
(FR) L'invention concerne une composition photodurcissable à conduction anisotrope qui comprend (A) une résine contenant un groupe carboxyle, (B) un monomère photopolymérisable, (C) un initiateur de photopolymérisation, (D) des particules électroconductrices, et de préférence (E) un composé époxy contenant dans une de ses molécules au moins deux groupes époxy en tant que composant thermodurcissable. Cette composition est capable, d'une part, de former un film à conduction anisotrope intercalé entre des bornes destinées à être électriquement connectées l'une à l'autre, d'autre part d'être développée par une solution aqueuse basique. Par exemple, lorsque des bornes TAB et ITO sont connectées dans un afficheur à cristaux liquides, ladite composition est appliquée uniquement sur les bornes destinées à être connectées à des électrodes ITO (2) formées sur le substrat de verre (1) d'un panneau à cristaux liquides. Cette composition est ensuite séchée, exposée à une lumière et développée afin de former des motifs à conduction anisotrope (10) uniquement sur les électrodes. Ultérieurement, des motifs de câblage (6) de TAB (5) sont disposés sur les motifs à conduction anisotrope (10), puis ils sont sertis aux ultraviolets afin d'être liés et durcis. Cette composition, ce motif et ce procédé de connexion peuvent servir à assurer la conductivité au niveau d'un point de connexion sans endommager l'isolation électrique entre les câbles adjacents.
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