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1. WO2000033096 - PROBE CARD FOR PROBING WAFERS WITH RAISED CONTACT ELEMENTS

Publication Number WO/2000/033096
Publication Date 08.06.2000
International Application No. PCT/US1999/028746
International Filing Date 02.12.1999
Chapter 2 Demand Filed 30.06.2000
IPC
G01R 1/073 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
G01R 31/28 2006.01
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
CPC
B23K 20/004
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
002specially adapted for particular articles or work
004Wire welding
B23K 2101/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
G01R 1/06711
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
G01R 1/06716
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
06716Elastic
G01R 1/07307
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
07307with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
G01R 1/07314
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
07307with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
07314the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Applicants
  • FORMFACTOR, INC. [US]/[US]
Inventors
  • ELDRIDGE, Benjamin, N.
  • GRUBE, Gary, W.
  • MATHIEU, Gaetan, L.
Agents
  • LARWOOD, David
Priority Data
09/204,74002.12.1998US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROBE CARD FOR PROBING WAFERS WITH RAISED CONTACT ELEMENTS
(FR) CARTE D'ESSAI POUR TRANCHES A ELEMENTS DE CONTACT SURELEVES
Abstract
(EN)
A probe card is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
(FR)
La présente invention concerne une carte d'essai conçue pour être mise en contact avec un composant électronique à éléments de contacts surélevés. En particulier, cette invention est utile pour mettre en contact une tranche de semi-conducteur avec des éléments de contact souples, des ressorts par exemple. Une carte d'essai comporte des bornes qui correspondent aux éléments de contact de la tranche. Selon un mode de réalisation préférée, les bornes se présentent sous forme de plots pouvant comporter un matériau prévu pour des contacts répétés. Idéalement, on utilise un transformateur spatial présentant des plots sur un côté et des bornes sur le côté opposé. Un élément d'interposition avec contacts élastiques assure la liaison entre un contact sur le côté opposé du transformateur spatial et une borne correspondante de la carte d'essai, laquelle bore est elle même reliée à une autre borne qui peut être connectée à un dispositif d'essai tel qu'un testeur classique.
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