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Machine translation
1. (WO2000029637) DIFFUSION BARRIER MATERIALS WITH IMPROVED STEP COVERAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2000/029637    International Application No.:    PCT/US1999/026408
Publication Date: 25.05.2000 International Filing Date: 08.11.1999
Chapter 2 Demand Filed:    09.06.2000    
IPC:
C23C 16/34 (2006.01), H01L 21/768 (2006.01)
Applicants: PRESIDENT AND FELLOWS OF HARVARD COLLEGE [US/US]; 17 Quincy Street Cambridge, MA 02138 (US) (For All Designated States Except US).
GORDON, Roy, C. [US/US]; (US) (For US Only).
LIU, Xinye [CN/US]; (US) (For US Only)
Inventors: GORDON, Roy, C.; (US).
LIU, Xinye; (US)
Agent: SCOZZAFAVA, Mary, Rose; Clark & Elbing LLP 176 Federal Street Boston, MA 02110-2214 (US)
Priority Data:
60/108,054 12.11.1998 US
Title (EN) DIFFUSION BARRIER MATERIALS WITH IMPROVED STEP COVERAGE
(FR) CORPS BARRIERES DE DIFFUSION AVEC POUVOIR COUVRANT DES GRADINS AMELIORE
Abstract: front page image
(EN)A chemical vapor deposition process is provided for the formation of conformal layers containing metal nitrides. A film consisting mainly of titanium nitride is deposited from a vapor mixture of tetrakis(diethylamido)titanium, ammonia and trimethylamine on a surface heated to about 350 °C. The process can be used to form diffusion barrier layers between metals and silicon in computer microcircuits.
(FR)L'invention concerne un processus de dépôt chimique en phase vapeur permettant de former des couches conformes renfermant des nitrures métalliques. Ce processus consiste notamment à former un dépôt d'un film essentiellement composé de nitrure de titane, à partir d'un mélange en phase vapeur de tétrakis(diéthylamido)titane, d'ammoniac, et de triméthylamine, sur une surface chauffée à 350 °C environ. Ce processus peut être utilisé pour former des couches barrières de diffusion entre les métaux et le silicium, à l'intérieur de microcircuits informatiques.
Designated States: CA, JP, KR, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)